Company News

Ultratech, Inc.

3050 Zanker Road, San Jose, CA, 95134, USA

  • 800-222-1213

Latest New Product News from
Ultratech, Inc.

Machinery & Machining Tools, Material Handling & Storage

Atomic Layer Deposition System offers field-upgradable options.

January 12, 2015

With optional low vapor precursor delivery system, Savannah G2 enables growth of such novel materials as single- and multi-component films from Perovskite, Yttrium, Lithium, and rare earth families. Other options — ellipsometry, Quartz Crystal Microbalance (QCM), and mass spectrometry — allow simultaneous growth of ALD films and real-time characterization of deposition process. Combined,... Read More

Test & Measuring Instruments

In-line Inspection System is designed for patterned wafers.

November 28, 2014

Superfast 4G high-volume, in-line 3D topography inspection system leverages coherent gradient sensing (CGS) technology. Resulting flexibility enables use of single wafer inspection tool type for measuring front side of patterned wafers across entire fab line. Offering 125 wph throughput for in-line, patterned wafer system, this open-architecture inspection platform uses direct,... Read More

Material Handling & Storage

Laser Spike Anneal System enables ambient control.

June 27, 2013

Built on Unity Platform™, Model LSA201 includes patented micro chamber design, which enables full-wafer ambient control in scanning laser system and does not require use of vacuum hardware. System is capable of running mixtures of any inert gases, but micro-chamber architecture is extendible to more reactive gases for future processes. LSA201 is suitable for interface engineering and film... Read More

Test & Measuring Instruments

In-Line Wafer Inspection System delivers high resolution.

November 8, 2012

Based on coherent gradient sensing (CGS) technology, Superfast 3G can be implemented anywhere in the production line: front-, middle-, and back-end-of-line. Over 800,000 points of data are measured per wafer, enabling range of applications from one measurement. This functionality also accelerates comprehensive within-die, die-to-die, and wafer-to-wafer process variation characterization.... Read More

Machinery & Machining Tools, Material Handling & Storage

Laser Spike Anneal System supports leading-edge logic devices.

December 24, 2010

Suited for front-end-of-line and middle-of-line applications, dual-beam Model LSA100L supports low-temperature processes such as nickel silicide formation. Single narrow CO2 laser beam heats wafer surface from substrate temperature of 400°C to peak annealing temperature in range of 1,100-1,350°C, while second laser beam is used to locally preheat wafer. Built on customizable Unity... Read More

Machinery & Machining Tools

Stepper suits advanced-packaging applications.

July 26, 2002

Saturn Spectrum 300e(2) stepper, offers dual-lamp illumination option, which provides wafer-plane irradiance (>3400 mW/cm²) and throughput while exposing thick resists. Its edge processing capabilities provide edge-exposure and exclusion capability to deliver yield, imaging, and throughput performance required for flip-chip and wafer-level packaging (WLP) applications. Stepper also uses... Read More

Machinery & Machining Tools

Stepper Family suits nanotechnology applications.

July 26, 2002

NanoTech(TM) 100 offers 1.0 or 0.8 micron lens options, Machine Vision System (MVS), and PC controller. NanoTech 160 is available with 2.0, 1.0, or 0.8 micron lens. NanoTech 190 offers 2.0 or 1.0 micron lens and application-specific, air-bearing rowbar patterning system. Designed for processing thick and thin films, NanoTech 200 features 1.4 or 1.0 micron lens options. With production resolution... Read More

Other Company News from
Ultratech, Inc.