MH&W International Corporation
Mahwah, NJ 07430
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Nanocrystalline Cores suppress EMI currents in motors.
Ranging in size from 63-500 mm O.D. and 50-450 mm I.D. with thickness of 30 mm, Cool BlueÃ-® Toroid Cores serve as common mode chokes to minimize build volume of damaging motor bearing currents in high-power inverter systems and turbine generator drives. Units also suppress asymmetrical EMI currents generated by parasitic currents of motors and their cables. Cores provide permeability from...
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Thermal Gap Filler cools and protects hot PCB components.
With 10 Shore 00 hardness, SoftthermÃ-® 86/200 can blanket over multiple components of differing height, contours, and planarity. It features elastic, structurally secure silicone filled with ceramic particles. Product retains its memory after compression, enabling it to be reused. Thermal resistance is 1.50 K/W, and thermal conductivity is 1.0 W/mK. Available in die-cut shapes and in sheet...
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Thermal Interface Material comes in 5 and 10 mil thickness.
Designed to attach heat sinks to hot PCB components, KoolBond(TM) consists of fine woven, nickel-coated copper fiber matrix with pressure-sensitive adhesive on outside. Woven copper closely conforms to irregular mounting surfaces to optimize thermal transfer, while double-sided PSA eliminates screws, clips, or other hardware. Thermal impedance is 0.42Ã-
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Nanocrystalline Cores suppress EMI currents in motors.
Ranging in size from 63-500 mm O.D. and 50-450 mm I.D. with thickness of 30 mm, Cool BlueÃ-® Toroid Cores serve as common mode chokes to minimize build volume of damaging motor bearing currents in high-power inverter systems and turbine generator drives. Units also suppress asymmetrical EMI currents generated by parasitic currents of motors and their cables. Cores provide permeability from...
Read More »
Thermal Gap Filler cools and protects hot PCB components.
With 10 Shore 00 hardness, SoftthermÃ-® 86/200 can blanket over multiple components of differing height, contours, and planarity. It features elastic, structurally secure silicone filled with ceramic particles. Product retains its memory after compression, enabling it to be reused. Thermal resistance is 1.50 K/W, and thermal conductivity is 1.0 W/mK. Available in die-cut shapes and in sheet...
Read More »
Thermal Interface Material comes in 5 and 10 mil thickness.
Designed to attach heat sinks to hot PCB components, KoolBond(TM) consists of fine woven, nickel-coated copper fiber matrix with pressure-sensitive adhesive on outside. Woven copper closely conforms to irregular mounting surfaces to optimize thermal transfer, while double-sided PSA eliminates screws, clips, or other hardware. Thermal impedance is 0.42Ã-
Read More »