Wafers

GaN-on-Diamond Wafer has gallium facing surface.
Wafers

GaN-on-Diamond Wafer has gallium facing surface.

Gallium-facing GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience. Measuring 10 mmÂ-², wafer has atomically smooth...

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Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.
Wafers

Gallium Nitride-on-Diamond® Wafer has 2 in. diameter.

GaN-on-diamond semiconductor wafer features single GaN layer atomically attached to freestanding, 25 micron thick, polycrystalline CVD diamond substrate. Nanometer proximity of chip's active region to diamond reduces heat build-up by extricating heat from core at instant of generation, permitting high temperature resilience for high-power, high-frequency electronic, solid-state white lighting,...

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Wafers

Flip Chip is designed for wafer bumping applications.

EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...

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