Wafers

PBC Linear Uni-Guide Shines in Wafer Manufacturing
Wafers

PBC Linear Uni-Guide Shines in Wafer Manufacturing

Rockford, IL - January 2, 2009 For Over 25 years, PBC Linear developed working relationships with its customers to help them save money and time by customizing PBC Linear products to their needs. From simple Pillow Block modification to a complex linear slides and stages, PBC Linear delivered on its expertise and the customer benefited with cost savings and rapid time to market! Class 10 clean...

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Substrates

Substrates supports sub-45 nm applications and architectures.

Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms. Top silicon layer of wafers is available in thicknesses ranging from 20-110 nm, while BOX can be as thin as 10 nm. Substrates are suited for partially depleted and fully...

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Material Handling Equipment

Owens Design Shines on the Solar Industry

Contract Design & Manufacturer for Capital Equipment expands into the Solar Industry by providing automated equipment used to manufacture Solar Cells Fremont California - Owens Design Inc. announces it has expanded its design & manufacturing capabilities to support the growing production equipment needs of the solar industry. Best known for their expertise in contract design and manufacturing of...

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Digital Memory

Spansion Initiates Production of 300mm 65nm MirrorBit® Flash Memory at SP1 Wafer Fabrication Facility

Ceremony Celebrating the World's First 300mm NOR Facility Held for Customers, Government and Community Officials AIZUWAKAMATSU, Japan, Sept. 19 - Spansion Inc. (NASDAQ:SPSN), the world's largest pure-play provider of Flash memory solutions, today announced that it has started production of MirrorBit® technology at 65nm on 300mm wafers at its Spansion 1 (SP1) facility in Japan, with plans to...

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Wafers

Microsemi Enters Silicon Carbide Supply Agreement with SemiSouth Laboratories

IRVINE, Calif., Aug. 13, 2007 - Microsemi Corporation (Nasdaq:MSCC), a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, and SemiSouth Laboratories Inc. of Starkville, Mississippi, announced today that they have entered into an agreement which provides for cooperation between the two companies in the area of silicon carbide (SiC)...

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Semiconductors

SOI Enables New Generations of Lower-Power Consumption Devices

SOI Poised for Further Adoption as Semiconductor Industry Tackles Energy Conservation and Consumption Challenges SAN FRANCISCO, July 17 - SEMICON WEST - Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) wafers and other engineered substrates, today announced it is intensifying its focus to ensure that the low-power advantages of SOI are accessible to...

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Electronic Cells

BP Solar Introduces Mono2

New Silicon Growth Process Yields Higher Efficiency in Commercial Cells and Modules A pioneer in silicon casting for solar photovoltaic cell applications, BP Solar has developed a new silicon growth process that significantly increases cell efficiency over traditional multi-crystalline-based solar cells. The new technique, named Mono2(TM), enhances BP Solar's technological expertise in the...

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Wafers

Silicon-on-Diamond Wafers Enable Transistor-Level Thermal Management

SANTA CLARA, CA - sp3 Diamond Technologies, Inc. (sp3), supplier of wafer scale diamond and diamond products for solving thermal management challenges in high-performance applications, announces a revolutionary new approach to thermal management in the semiconductor industry: silicon-on-diamond (SOD) wafers. After thorough research, sp3 has developed a proprietary chemical vapor deposition (CVD)...

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Wafers

XACTIX and STS Unveil Comprehensive Line of Production-Oriented Xenon Difluoride Silicon Etch Systems

Semicon West, SAN FRANCISCO, July 11 // -- Developer and producer of equipment for manufacturing micro electromechanical systems (MEMS), XACTIX, Inc., and Surface Technology Systems PLC , a leader in plasma process technologies required in the manufacturing and packaging of MEMS and advanced electronic devices, today announced that they plan to unveil a comprehensive line of production-oriented...

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Wafers feature diamond on silicon construction.
Wafers

Wafers feature diamond on silicon construction.

Advanced Diamond Technologies (ADT) DoSi(TM) (diamond on silicon) electronics-grade wafers are coated with Ultrananocrystalline Diamond(TM) (UNCD(TM)) material, which exhibits all properties of natural diamond but with mirror-smooth surface that allows for control of surface properties. Suited for research and product design, wafers available in 100, 150, and 200 mm standard sizes and can be...

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