Wafers

Fused Silica Wafers measure quality of optical coatings.
Wafers

Fused Silica Wafers measure quality of optical coatings.

Exhibiting less than 10 Ã-... surface roughness with surface quality of 40-20, TECHSPEC® Fused Silica Wafers are thin, circular pieces of UV fused silica designed to be used as test substrates to measure quality of optical coatings. Each is ultrasonically cleaned and delivered in contaminant-free packaging. Available in 100, 200, and 300 mm diameters, RoHS-compliant wafers have thickness...

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Wafers

Natcore's Black Silicon Succeeds in First-Ever Solar Cell Production Line Test

This indicates that Natcore's black silicon is commercially viable": Provini RED BANK, N.J.Â- — One of the world's largest photovoltaic manufacturers has been the first to process Natcore Technology's black silicon wafers into working solar cells in an actual production line rather than in a laboratory setting. The wafers were given a black silicon etch by scientists of Natcore Technology...

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Wafers

Axcelis Announces Multiple Wins for 'Purion XE' High Energy System Including New Foundry Penetration

Innovative Platform Delivers Industry Leading Purity, Precision and Productivity to Meet Future Process Challenges as Well as Today's Production Requirements BEVERLY, Mass.Â- — Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced multiple wins for the Company's Purion XE single wafer, high energy...

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Wafers

Showa Denko to Launch 6" SiC Epitaxial Wafers for Power Devices

To Contribute to Commercialization of Next-Generation Inverters Tokyo -- Showa Denko (SDK) (TOKYO: 4004) will next month launch silicon carbide (SiC) epitaxial wafers with a diameter of six inches (150mm) - the largest size currently available on the world market - for use in power devices. The company will also start selling next month a new grade of four-inch (100mm) SiC epitaxial wafers with...

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Substrates

Soitec's RF SOI Wafers Now Mainstream in Mass Producing Smartphones' Switches

SAN FRANCISCO – Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced at the Semicon West trade show that its silicon-on-insulator (SOI) technologies are now mainstream for manufacturing switches and antenna-tuners, key RF components used in all cell phones and tablet computers. According to the...

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Wafers

Epitaxial SiC Films Grown on 300mm Si Wafers

Potentially an ultimate barrier film for GaN on silicon NEWPORT, England and BRISBANE, Australia -- The Queensland Micro and Nanotechnology Facility (QMF) of Griffith University and industry partner SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, have announced epitaxial growth of 3C silicon carbide (SiC) films on...

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Mechanical Accelerators

Single Wafer High Energy Implanter offers precision, throughput.

Incorporating single wafer LINAC technology, Purion XE ion implanter enables high-yield manufacture of sub-16 nm planar and 3D devices. System incorporates 500+ wafers/hr end station and advanced filtration systems. Latter optimize beam purity, while angle control system and constant focal length scanning deliver precise and repeatable dopant placement. Scanned spot beam architecture enables...

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Circuits

Silex Microsystems and BroadPak Bring 2.5D IC Packaging Capabilities to the Mainstream Market through Low-Cost, High-Performance Silicon Interposers

Represents the First Partnership to Address the Cost, Engineering and Supply Chain Challenges Associated with Silicon Interposers Needed for Next Generation Chip Designs JARFALLA, Sweden and SAN JOSE, Calif. - Silex Microsystems, the world's largest pure-play MEMS foundry, and BroadPak, a leading provider of ultra-high performance 2.5D silicon interposer and 3D integration technologies, today...

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