EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...
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Enpirion Partners with Future Electronics to Offer the World's Lowest-cost Power-System-on-Chip DC-DC Converters
Global Availability marks Industry's First Wafer-Level Magnetics Based Integrated Power ICs MONTREAL, Canada and HAMPTON, NJ - Enpirion, the leader of integrated power IC solutions, and Future Electronics, a global leading distributor of electronic components announce the availability of products based on the world's first wafer level magnetics (WLM) technology. In partnering with Future...
Read More »Automated Load Lock handles batches of small substrates.
Benefitting companies in early stages of process development and characterization, Star SL-450 transfers single substrates or substrate holders up to 450 mm in diameter. System uses intelligent motor to transfer and track position of substrate. With Z-lift option, Star SL-450 can hand-off substrates to any process module, including those without lift pins.
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Pressure Vessels & Their Components
This white paper provides an in-depth look into custom fabricated pressure vessels and their components.
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High or Low Volume Custom Crates and Boxes Available from Reid Packaging
Reid provides mil-spec crates and corrugated boxes in custom dimensions from single to triple wall and will even package them on-site. Check out the video to learn more.
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