Wafer Transfer Systems

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
Wafer Transfer Systems

EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications

ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...

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Enpirion Partners with Future Electronics to Offer the World's Lowest-cost Power-System-on-Chip DC-DC Converters
Wafer Transfer Systems

Enpirion Partners with Future Electronics to Offer the World's Lowest-cost Power-System-on-Chip DC-DC Converters

Global Availability marks Industry's First Wafer-Level Magnetics Based Integrated Power ICs MONTREAL, Canada and HAMPTON, NJ - Enpirion, the leader of integrated power IC solutions, and Future Electronics, a global leading distributor of electronic components announce the availability of products based on the world's first wafer level magnetics (WLM) technology. In partnering with Future...

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Wafer Transfer Systems

Automated Load Lock handles batches of small substrates.

Benefitting companies in early stages of process development and characterization, Star SL-450 transfers single substrates or substrate holders up to 450 mm in diameter. System uses intelligent motor to transfer and track position of substrate. With Z-lift option, Star SL-450 can hand-off substrates to any process module, including those without lift pins.

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CMAA Crane Buyer's Guide
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CMAA Crane Buyer's Guide

CMAA has organized this Buyer's Guide to promote standardization and to assist prospective buyer's of electric overhead traveling cranes in selection of equipment most suitable for their applications.

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