EV Group Ships 300-mm Wafer Bonding System to Leading Chinese Semiconductor Foundry for 3D IC and Advanced Packaging Volume Production Applications
ST. FLORIAN, Austria - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC...
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Enpirion Partners with Future Electronics to Offer the World's Lowest-cost Power-System-on-Chip DC-DC Converters
Global Availability marks Industry's First Wafer-Level Magnetics Based Integrated Power ICs MONTREAL, Canada and HAMPTON, NJ - Enpirion, the leader of integrated power IC solutions, and Future Electronics, a global leading distributor of electronic components announce the availability of products based on the world's first wafer level magnetics (WLM) technology. In partnering with Future...
Read More »Automated Load Lock handles batches of small substrates.
Benefitting companies in early stages of process development and characterization, Star SL-450 transfers single substrates or substrate holders up to 450 mm in diameter. System uses intelligent motor to transfer and track position of substrate. With Z-lift option, Star SL-450 can hand-off substrates to any process module, including those without lift pins.
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Rack System Design & Buyer's Guide
There is plenty to consider before setting up or replacing storage rack systems in your warehouse. This whitepaper contains a guide and general checklist of the most important considerations.
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Locon Sensors Withstand Extreme Temperatures
Locon Sensor Systems offer robust sensor solutions for even the most severe environmental conditions. Their line of high-temp inductive sensors and their cylindrical photoelectric series can operate in temperatures up to 250 degrees Celsius. See our video to learn more.
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