Potting Process can be used with hermetic connectors.
Epoxy potting method, adaptable to various connector styles and wire bundles, allows connectors to pass helium leakage rate tests of 1 x 10-6-1 x 10-9. Designed to replace glass hermetic connectors with stated helium leak rate range, process is suited for military, aerospace, and industrial applications.
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What Affects the Price of Electronics Manufacturing?
The eBook provides an overview of designing for manufacturability, exploring what it means and discussing what to do to design costs out of electronic manufacturing projects.
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Acoustic and Thermal Solutions for Original Equipment Manufacturers
Technicon's products solve the most complex noise pollution and thermal problems and improve product marketability. Check out the video to learn more.
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