Cut & Paste Printed Resistors and Capacitors for Flexible Film Substrates
DKN Research, a leading engineering firm specializing in micro electronics and packaging technology, recently developed a new passive component series of Printed Resistors and Capacitors built with fine silver thick film circuits on flexible film substrates for cut & paste applications. This is possible through an advanced screen-printing process using special silver inks, carbon inks, dielectric...
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Micro-Assemby helps protect dc power ports.
Suited for portable equipment that utilizes barrel jacks for dc power input, PolyZen(TM) polymer-enhanced micro-assembly protects sensitive electronics from damage caused by inductive voltage spikes, voltage transients, incorrect power supplies, and reverse bias. It incorporates stable Zener diode for precise voltage clamping and resistively non-linear, polymer positive temperature coefficient...
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The Definitive Guide to High-Capacity Autonomous Mobile Robots
This white paper is a complete guide to understanding autonomous mobile robots and their crucial role in various types of material handling applications.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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