Mask Alignment System manufactures high-brightness LEDs.
Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be...
Read More »Mask Alignment System manufactures high-brightness LEDs.
Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be...
Read More »EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development
ST. FLORIAN, Austria, June 1, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)-Taiwan's largest and one of the world's leading high-tech R&D institutions--in the development of advanced manufacturing processes...
Read More »EV Group Teams with Industrial Technology Research Institute (ITRI) on Advanced MEMS Research and Development
ST. FLORIAN, Austria, June 1, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is collaborating with the Industrial Technology Research Institute (ITRI)-Taiwan's largest and one of the world's leading high-tech R&D institutions--in the development of advanced manufacturing processes...
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Read More »Mask Alignment System offers high-throughput wafer processing.
Model EVG620HBL automated mask alignment system delivers throughput of up to 165 six-inch wafers/hr for manufacturing high-brightness LEDs, compound semiconductors, and power electronics. System includes high-intensity UV light source and 5 cassette stations. Also included are recipe-controlled microscopes with illumination spectrum that optimizes pattern contrast with various wafer and layer...
Read More »Mask Alignment System offers high-throughput wafer processing.
Model EVG620HBL automated mask alignment system delivers throughput of up to 165 six-inch wafers/hr for manufacturing high-brightness LEDs, compound semiconductors, and power electronics. System includes high-intensity UV light source and 5 cassette stations. Also included are recipe-controlled microscopes with illumination spectrum that optimizes pattern contrast with various wafer and layer...
Read More »Dedicated Lithography System meets LED industry needs.
Used for production of high-brightness light emitting diodes (HB-LEDs), MA100e Gen2 Automatic Mask Aligner processes wafers up to 4 in. and enables throughput of 145 wafers/hr. High-intensity exposure optics and pre-alignment options minimize process time, while functionalities such as proximity exposure for high resolution down to 2.5 -µm maximize yield. All together, functionality helps LED...
Read More »Dedicated Lithography System meets LED industry needs.
Used for production of high-brightness light emitting diodes (HB-LEDs), MA100e Gen2 Automatic Mask Aligner processes wafers up to 4 in. and enables throughput of 145 wafers/hr. High-intensity exposure optics and pre-alignment options minimize process time, while functionalities such as proximity exposure for high resolution down to 2.5 Ã-µm maximize yield. All together, functionality helps...
Read More »Mask and Bond Aligner provides diverse process flexibility.
Designed to accommodate university and research demands, EVG610 mask and bond alignment system can process substrate pieces and wafers up to 200 mm. This flexible R/D system supports processes such as UV-nanoimprint lithography (UV-NIL) and fine patterning, wafer bumping, and chip-scale packaging for MEMS, IC, and compound semiconductor devices. Flexible configurations are available, for pieces...
Read More »Mask and Bond Aligner provides diverse process flexibility.
Designed to accommodate university and research demands, EVG610 mask and bond alignment system can process substrate pieces and wafers up to 200 mm. This flexible R/D system supports processes such as UV-nanoimprint lithography (UV-NIL) and fine patterning, wafer bumping, and chip-scale packaging for MEMS, IC, and compound semiconductor devices. Flexible configurations are available, for pieces...
Read More »560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
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