X-ray System enables nondestructive testing.
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Press Release Summary:
Nanome|x, a nanofocus 4-in-1 failure analysis system, suits complex semiconductor devices and highly integrated electronic assemblies as well as micro mechanics and material testing. Nanofocus(TM) tube can be operated in 4 modes, providing nanometer resolution to high-power radiation. User can resolve detail of 200-300 nm, displaying defects in miniaturized assemblies. System deploys ovhm|module technology that allows 2000x magnification and 3D-like imagery.
Original Press Release:
New 4-In-1 Failure Analysis System Performs NDT On Micromachines, Inspection of PCBAs, FA On Semiconductors And Material Analysis
Camarillo, CA (March 17, 2004) - phoenix|x-ray Systems + Services Inc., innovator of the first commercially available nanofocus x-ray system and first fully automated failure analysis system, today introduced to the North American market their nanome|x, a high-powered nanofocus 4-in-1 failure analysis system. A combination of high-end x-ray technology packaged in an ergonomic, user-friendly design, the nanome|x is a powerful x-ray inspection and failure analysis system that can perform the most sophisticated nondestructive testing (ndt) processes and resolve the most minute details. The system is designed to aptly meet manufacturers' requirements of complex semiconductor devices and highly integrated electronic assemblies yet can be used in the field of micromechanics and material testing as well.
The company introduced the nanome|x to the North American market at APEX 2004 and initially introduced the system at Productronica in Munich, Germany in November 2003. The design is a result of a close partnership with its customers across several fields of applications. As a result, the nanome|x uses a high-powered nanofocus(TM) Tube that can uniquely be operated in four modes (4 tubes in 1) covering the whole range from nanometer resolution to high-power radiation. This means the user can resolve an extreme level of detail (200 - 300 nm (0.2 - 0.3 microns)), displaying the slightest defect in miniaturized assemblies like pad wetting failures in Flip Chip solder joints or cracks in bond wires with verifiable results. The same tube is infinitely variable up to 160kV and can also power up to 50W making it possible to see through highly absorbent materials like tungsten alloys used in IC packages or injector nozzles, or MEMS - something that cannot be achieved with conventional submicron resolution X-ray tubes.
The nanome|x x-ray system deploys the company's ovhm|module technology that, without rotation of the board and thus loss of magnification in the oblique, allows for a high magnification (2000x) and 3D-like imagery with 2D magnification acquisition speeds. The tube and detector rotate up to 70° around the sample while providing the needed oblique view necessary to see minute defects in small solder joints found in FBGAs, uBGA®, CGAs, CSPs and Flip Chips. This option is ideal for determining z-position solder voids, inspecting wetting quality, detecting cracks in bond wires, inspecting BGA device joint stacks and ball bond quality, and measurement of via plating in both IC and PCB production.
The intensifier in the system is a digital detector technology and video system that delivers superior, distinct images in pseudo real-time of poor absorbing materials with enhanced contrast, ideal for ndt and material inspection.
Additional features include the automated inspection of BGA and QFP solder joints by a unique algorithm for the automated pad wetting analysis, software for the automated backend inspection including automatic measurement and qualification of the bond wire sweep according to MIL-STD-883E quality assurance standard, software for the automated die-attach voiding calculation following user-defined standards, and an ergonomic design for comfortable operation seated or standing, for left- or right-handed people.
Price and Availability
The nanome|x is listed at $260,000 and is deliverable within four to six weeks. For more information, customers should contact David K. Lehmann, President, at 805.389.0911 ext. 11 or via e-mail at dklehmann@phoenix-xray.com
About phoenix|x-ray
phoenix|x-ray Systems + Services Inc. is the North American sales, service, and applications engineering subsidiary of the Germany-based microfocus X-ray system manufacturer, phoenix|x-ray Systems + Services GmbH. This group of companies offers both sealed tube and open tube microfocus/nanofocus X-ray systems dedicated to PCB assembly, back-end and multilayer inspection applications. As an open-tube design and manufacturing house, phoenix|x-ray holds technology leadership for ultra-high resolution and magnification.
Customer contact
For more information on phoenix|x-ray Systems + Services Inc. or its products, customers should contact David K. Lehmann, Vice-President of Sales at 3883 Via Pescador, Unit A; Camarillo, CA 93012; Toll Free: 877-PHX-XRAY (877.749.9729); Telephone 805.389.0911, ext. 11; Fax 805.445.9833; Email: dklehmann@phoenix-xray.com; website: www.phoenix-xray.com.
