Visit Piab at Pack Expo International 2010

Piab, a leading supplier of industrial vacuum technology, is launching its new piGRIP(TM) suction cup, the first modular suction cup on the market, at PACK EXPO International 2010, October 31-November 3, at McCormick Place, Chicago, IL, USA. The new piGRIP allows companies to choose the ideal combination of lip and bellow so packaging lines can handle products at previously unprecedented speeds while realizing energy savings.

At the show, Piab will also showcase its new piINLINE(TM) range of inline vacuum ejectors. Based on COAX® technology, the piINLINE range offers good vacuum flow and enables reliable gripping, lifting and moving of objects for reduced line downtime. piINLINE solutions are more eco-friendly than single-stage ejectors, with the smallest model using 50 percent less energy on average than comparable products.

Piab's range of vacuum technology will be on display at booth N-4620.
To schedule a booth appointment with a Piab executive, please click one of the links below or contact Maria Arias at +1 (212) 529-2584 or email


Maria Arias

ABI, Inc.

29 Broadway

Suite 1300

New York, NY 10006

+1 (212) 529 4500

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