Universal Releases Fuzion Platform to Asia Market


Introduction showcases innovative solution that reduces costs while maximizing efficiency, quality, and return on assets.



Universal Instruments is taking its award-winning Fuzion™ Platform (winner of Circuits Assembly magazine’s NPI award as the top machine in the “Component Placement – Multi-Function” category) on a series of road shows in Asia. The company will feature its FuzionXC2-37 model with live demonstrations, as well as product and technical presentations.



Universal had a record turnout at its first event in Dongguan, China, on March 14 and expects equally strong attendance at the shows in Chengdu, China, on March 27 and Singapore April 3-10 as manufacturers in Asia recognize the exceptional value that Fuzion delivers. In addition, Universal will exhibit in cooperation with its channel partner Gentron at the NEPCON Shanghai trade show (April 24-25).



Universal’s Fuzion Platform solutions maximize revenue opportunities and utilization for the greatest possible profitability. The FuzionXC2-37 enables manufacturers to quote any job, regardless of board size, component range, or input type. This flexibility also ensures optimal line balancing and eliminates bottlenecks. FuzionXC2-37 leverages more than twice the feeder capacity of alternative solutions to streamline changeovers and maximize uptime. OEMs and EMSs can take advantage of the feeder capacity by replacing multiple modules with a single Fuzion to dramatically reduce CapEx and operational costs while maximizing floor space utilization.



Universal Vice President of Customer Operations Brad Bennett commented, “We look forward to showcasing the capabilities of our Fuzion solutions in Asia. The FuzionXC2-37 delivers distinct advantages with its unique architecture and flexibility.” Bennett continued, “We’ve also integrated additional enhancements that will further improve the return on assets for our customers. Fuzion software features a native language interface, including Chinese, and a new suite of tools that facilitate efficient and error-free first-article builds. Fuzion platforms also benefit from all-new, easy-loading ion™ feeders that are 30% smaller and 25% lighter than our previous generation, and feature a top-loading design that reduces replenishment and changeover times by 50%.”



To learn more about these regional events, please contact the following Universal Instruments management team members:

Chengdu

Karfeldt Wu

regional sales manager

+86 755-2686-0160 ext. 168 

wuk@uic.com



Singapore 

Mark Norris

area general manager

+60 464-470-67 

mnorris@uic.com;



NEPCON Shanghai

(Jacky) Jun Wu

regional sales manager

+86 21-6495-2100 ext. 215 

wuj@uic.com.



About Universal Instruments

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, N.Y., with offices in Europe, Asia, and the Americas.

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Universal contact

Jeffrey Zopff

Global Marketing Communications Manager

Universal Instruments Corporation

33 Broome Corporate Parkway

Conklin, NY 13748

USA

Tel: +1 607 779 5364

Email: zopff@uic.com

www.uic.com

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