Universal Demonstrates SM and IM Platforms at NEPCON China


From high-speed chip placement to multi-span through-hole and more, comprehensive portfolio enables complete factory automation.



Universal Instruments will feature two offerings from the industry’s broadest technology portfolio at the 2015 NEPCON China trade show to be held at the Shanghai World Expo Exhibition Convention Center on April 21 – 23. The company will exhibit its award-winning Fuzion® surface mount platform, demonstrating the Fuzion2- 60™ variant as well as the Radial 88HT 3.5mm radial insertion platform on Channel Partner Gentron’s Stand: B- 1F16. These products are representative of Universal’s complete solutionslineup of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation.



“We help our customers implement a fully automated manufacturing model by leveraging a complete technology portfolio combined with the process expertise and special tooling needed to achieve this,” noted Universal Instruments Vice President of Marketing, Glenn Farris. “We then help them get the most out of their equipment investment by providing factory software tools to monitor and maximize operational efficiency.”



On the booth, Universal will highlight the capabilities of its Radial 88HT 3.5mm radial component sequencer and inserter. With 2.5/3.5/5.0mm triple-span tooling, the Radial 88HT automates a wide range of radial components at consistently high throughputs with an industry-leading reliability of 300 ppm.



Universal’s Fuzion2-60 will also be on display, featuring a 01005 – 30 mm square component range, industryleading cost per placement, and a low cost of ownership. Fuzion2-60 is a powerful line booster or highperformance small part placement solution for a variety of production environments.



“We’ve enjoyed great success with our insertion mount and surface mount customers over the years here in China and it’s a pleasure to demonstrate these products on our booth,” commented Farris. “As the industry evolves to embrace an automated, integrated smart factory concept, we also want to highlight our value as a complete solutions provider with both the expertise and breadth of technologies to help manufacturers realize this.”



To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com.



About Universal Instruments

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal Instruments delivers comprehensive solutions to a global customer base by leveraging exclusive process expertise combined with its innovative portfolio of flexible platforms for surface mount, insertion mount, advanced semiconductor packaging, and end-of-line automation. Universal Instruments is headquartered in Conklin, N.Y., USA, with offices in Europe, Asia and the Americas.



Universal Instruments contact

Jeffrey Zopff

Global Marketing Communications Manager

Universal Instruments Corporation

33 Broome Corporate Parkway

Conklin, NY 13748

USA



Tel: +1 607.779.5364

Email: zopff@uic.com

www.uic.com  

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