Tx/Rx Modules allow for multi-gigabit data transmission.
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Press Release Summary:
Operating over E-band frequency spectrum from 71.0-86.0 GHz, Tx/Rx Modules enable broadband point-to-point radios to carry voice and data traffic at multi-gigabit/sec rates. Transmit module includes conversion gain of 15 dB and output power of 16 dBm, while receiver module provides noise figure of 9 dB, better than 25 dB RF-to-IF conversion gain, and P1dB of -25 dBm. Both modules use MLMS(TM) sub-harmonic mixer topology that provides single level of conversion direct from E-Band to IF.
Original Press Release:
E-Band Tx/Rx Modules Allow for Multi-gigabit Data Transmission
SAN JOSE, CA-February 20, 2007-Endwave Corporation (NASDAQ: ENWV), a provider of high-frequency RF modules for telecommunications networks, defense electronics and homeland security systems, has announced the release of a new transmit-receive module pair that operates over the E-band frequency spectrum from 71.0-86.0 GHz. These modules enable broadband point-to-point radios to carry voice and data traffic at multi-gigabit per second rates.
The typical performance of Endwave's transmit module includes a conversion gain of 15 dB and an output power of 16 dBm, with an integrated power detector on the Tx output. Higher-power transmitter options are also available upon request. Endwave's E-band receiver provides a noise figure (NF) of 9 dB, better than 25 dB of RF-to-IF conversion gain, and an input one dB compression point (P1dB) of -25 dBm. Separate models cover the 71-76 GHz and 81-86 GHz operating bands. Both Tx and Rx use an MLMS(TM) sub-harmonic mixer topology that provides a single level of conversion direct from E-Band to IF. Endwave's E-band MLMS mixer design provides functionality and performance that is not even available in MMIC format today. This architecture significantly reduces the cost of the local oscillator (LO) circuit chain relative to the costs of comparable fundamental mixer approaches. Call an Endwave applications specialist to discuss other options, including the addition of customized VCO-based synthesizers to drive the up-conversion and down-conversion processes in the Tx and Rx, respectively.
These E-band Tx/Rx modules are the first ever to employ both of Endwave's newest proprietary technologies, MLMS(TM) and Epsilon(TM) Packaging, in a single RF subsystem solution. These innovations facilitate small size and low cost, and with successful implementation on these E-Band products, this demonstrates the viability of these technologies in applications from low RF frequencies to over 100 GHz.
Epsilon enables mixed chip-on-board and SMT on a single printed circuit structure
MLMS sub-harmonic mixers are unique to the Industry
MLMS passive circuitry (filters, couplers, W/G probes)
Sub-harmonically pumped Tx/Rx architecture
Supports modulation formats ranging from On-Off Keying to 16 QAM Modulation
Closed-Loop AGC on TX Output Available (Up to 10 dB Range)
On-Board Microcontroller for Software-Controlled Compensation
E-band radio links offer a compelling alternative to terrestrial fiber optic cable in a variety of commercial, military, and government end-use applications. These include: ubiquitous high-speed networks for business and campus environments; virtual private networks (VPNs); systems for carrier loop diversity and disaster recovery from central office to large office buildings; routing by cable operators (MSOs) of commercial Ethernet to extend coverage out to large building complexes; high-data-rate backhaul for cellular, WiMax, and WISP (wireless internet service provider) operators; HDTV signal routing; and other fiber substitution applications.
The advantages of wireless E-band links versus wired fiber-optic solutions include substantially lower deployment costs, deployment speeds that are measured in days (rather than months, or even a year for fiber), and reduced regulatory and environmental approval burdens.
About Epsilon Packaging
To counter the high costs of conventional mechanical housings, covers, and other packaging complications found in typical millimeter-wave modules, Endwave has incorporated Epsilon Packaging technology into its Tx/Rx designs. Epsilon eliminates the traditional dependency on bulky machined or cast mechanical housings by replacing costly mechanical items with metalized FR-4 and injection molded metalized plastics. The end result is a package with no machined metal parts that is mass producible with minimal weight and size. Further innovation has allowed us to combine a variety of technologies, including SMT, chip-on-board, and bare chip-and-wire, into perfectly integrated modules that fit seamlessly into system architectures. Epsilon Packaging is targeted at high-frequency applications where low cost, light weight and small form factor are essential.
About MLMS (Multilithic Microsystems)
MLMS is a MMIC-alternative technology that uses active flip-chip circuits and EM coupling methods to minimize semiconductor real estate and RF wire-bonding. In MLMS we've moved passive circuitry onto an inexpensive MEMS-like substrate that processes with the ease of silicon, but works to 100 GHz. MLMS is a "mixed" IC technology platform, allowing for a true system-on-a-chip. For example - use an InP LNA, a SiGe VCO, and a GaAs PHEMT multiplier all on a single MLMS chip to optimize system performance. Endwave's MLMS device library is growing rapidly, with industry pacing mixers, frequency multipliers, high linearity voltage-variable attenuators (VVAs), detectors, and passive devices such as filters and Lange couplers.
About Endwave
Endwave Corporation designs, manufactures, and markets RF modules that enable the transmission, reception and processing of high-frequency signals in wireless telecommunications networks, defense electronics and homeland security systems. Endwave Defense Systems, an operating division of Endwave, specializes in the unique requirements of defense, homeland security, and other government end-use applications. The company's RF modules consist of microwave components and subsystems, including integrated transceivers, JCA Amplifiers, frequency multipliers, up and down converters, oscillators, synthesizers, microwave switch arrays, and other custom multi-function assemblies (MFAs). Endwave has 42 issued patents covering its core technologies including semiconductor and proprietary circuit designs. Corporate headquarters are located in San Jose, CA, with other operations in Diamond Springs, CA; Andover, MA; and Chiang Mai, Thailand.
www.endwave.com
Company Contact:
Mark Hebeisen, mark.hebeisen@endwave.com
Vice President
Marketing & Business Development
978-686-4400, x105
