Press Release Summary:
Respectively offered in uDFN-6 and SOT23-6 packages, SP3012-03UTG and SP3012-04HTG protect sensitive chipsets with high-speed data lines from external ESD events (Â±12 kV min contact, Â±25 kV min air). Form factor simplifies PCB layout by allowing traces to run directly underneath device and conserve board space. While clamping voltageÂ promotes reliable equipment performance in field, capacitance of 0.5 pF minimizes signal degradation and distortion. Dynamic resistanceÂ is 0.4 Ω.
Original Press Release:
New Packaging Options for Littelfuse SP3012 Series TVS Diode Arrays Provide Greater Layout Flexibility
Up to 66 Percent Greater Clamping Performance than Other Industry Options
CHICAGO — Littelfuse, Inc., the global leader in circuit protection, has added two new packaging options to its SP3012 Series TVS Diode Array (SPA® Diodes) line. Like the rest of the series, these new devices are optimized for protecting sensitive chipsets with high-speed data lines from external ESD (electrostatic discharge) events. The new SP3012-03UTG (uDFN-6) and SP3012-04HTG (SOT23-6) devices offer board designers more options and greater layout flexibility. They also provide up to 66 percent greater clamping performance than other industry options, ensuring greater chipset reliability.
Typical applications for these new additions to the SP3012 Series include ultrabooks, LCD TVs, set-top boxes, Ethernet switches, etc.
“With a dynamic resistance of just 0.4 ohms, the SP3012-03UTG and SP3012-04HTG provide a much lower clamping voltage than other devices available in the industry, which helps to ensure more reliable equipment performance in the field,” said Chad Marak, Product Line Director, TVS Diode Arrays. “Additionally, their ultra-low capacitance minimizes signal degradation so the design engineer doesn’t have to trade off protection for system performance.”
Ultra-low capacitance of 0.5pF minimizes signal degradation and distortion for high-speed applications such as HDMI 1.3/1.4 and USB 2.0, USB 3.0, DisplayPort, etc.
Very low dynamic resistance of 0.4Ω provides very low clamping voltages to protect sensitive high-speed chipsets.
ESD capability is a minimum of ±12kV (contact), ±25kV (air), which exceeds the highest level of the IEC61000-4-2 standard (Level 4).
Small form factor packages simplify the PCB layout by allowing the traces to run directly underneath the device and save valuable board space.
Samples are available now; sample requests can be placed through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit littelfuse.com.
For More Information
SP3012 Series TVS Diode Arrays are available in reels of 3,000. Additional information is available on the SP3012 Series product page including a datasheet. If you have technical questions, please contact: Chad Marak, Product Line Director, TVS Diode Arrays, firstname.lastname@example.org.
Founded in 1927, Littelfuse is the world leader in circuit protection with growing global platforms in power control and sensing. The company serves global customers in the electronics, automotive and industrial markets with technologies including fuses, semiconductors, polymers, ceramics, relays and sensors. Littelfuse has over 7,000 employees in more than 35 locations throughout the Americas, Europe and Asia. For more information, please visit the Littelfuse website: littelfuse.com.