Thermoelectric Coolers have up to 100 W/cm² cooling power.
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Press Release Summary:
Supporting maximum temperature difference (delta T) of over 60° Kelvin, Series MPC-D303 microchip thermoelectric coolers (TECs) target laser and photonic sensor manufacturers. Fabricated on silicon wafer using standard semiconductor processes and soldered at 300°C, chip-sized TECs feature cold side area of only 0.98 mm². With maximum operating temperature of 200°C, they can realize temperature changes faster than 180° K/sec.
Original Press Release:
Ultra-Small Micropelt Peltier Coolers Have 60 Kelvin Delta T for Fiberoptic and Sensor Applications
Freiburg, Germany - August 30, 2007 - Micropelt GmbH, manufacturer of thin film thermoelectric devices, announces a significant technology advancement in its ultra-small, microchip thermoelectric coolers (TECs). The new MPC-D303 Series, one of Micropelt's smallest TECs with a cold side area of only 0.98 square millimeters (mm²), supports a maximum temperature difference (delta T) of over 60 Kelvin (K). This increased delta T opens possibilities for laser and photonic sensor manufacturers whose applications require a large bandwidth of thermal control.
The Micropelt MPC-Dx series has a cooling power of up to 100 watts/cm² and can realize temperature changes faster than 180 K/second. It is perfect for highly dynamic thermal control with 10 K ramps in just a few milliseconds. Its high cooling power density optimally supports small devices' high cooling requirements. Based on Micropelt's exclusive thin film thermoelectric technology, the new cooler's core is sputtered material that can be structured to exactly match the thermal and electrical requirements of many applications. This match can reduce overall energy consumption and improve thermal management.
The MPC-D303, like all Micropelt products, is fabricated on silicon wafer using standard semiconductor processes. The device soldering temperature is 300 degrees Celsius and uses lead-free solder to comply with RoHS initiatives. It has a maximum operating temperature of 200 degrees Celsius. This chip-sized thermoelectric cooler offers superior performance for chip scale thermal management and fast, precise temperature control. Perfectly adapted designs, from less than 1mm² to 25mm², each with customizable thermal and electrical properties including sensor integration, open new dimensions of thermal management.
Applications for the MPC-D303 microchip thermal coolers include laser and sensor temperature management, micro-scale thermal cycling, lab-on-a-chip, single well to large array PCR cycling, technical device characterization, and printed circuit board embedded device cooling.
"Many of our customers wanted to leverage our extremely small form factor and high cooling power densities for their smaller and more highly integrated packages," explained Fritz Volkert, CEO of Micropelt. "Now that we've expanded our delta T from 40 K to 60 K, we offer them the product they've been asking for."
"Ever increasing integration and packaging densities are driving photonics development to smaller, faster, better performing products," said Dr. Joachim Nurnus, CTO of Micropelt. "Our advanced thin film thermoelectric platform technology holds exciting potential for further cooler miniaturization in the photonics, microelectronics, and life science worlds."
For Micropelt MPC-D303 thermoelectric coolers volume prices will be below 10 USD. Contact Micropelt for engineering samples. Detailed specifications for the MPC-D303 Series are available on the data sheet located at www.micropelt.com/down/datasheet_mpc_d303.pdf.
About Micropelt
Micropelt GmbH is a venture capital-funded technology company founded in early 2006 as a result of a research cooperation between German chipmaker Infineon Technologies and the Fraunhofer Institute for Physical Measurement Techniques in Freiburg, Germany. Micropelt develops and markets miniaturized thermoelectric (TE) coolers and generators based on scalable silicon MEMS (Micro Electro-Mechanical Systems) platform technology. Compared to conventional thermoelectric coolers, Micropelt's unique and patented technology has smaller component sizes, 10 times higher cooling or heating power densities, and economies of scale close to those found in chip-making industries.
Besides replacing small conventional TE coolers, Micropelt products can be used to create new and improved technologies in life science, wireless, laser, photonic, sensor, electronic, and other markets where micro-scale thermal management and control are needed. For more information contact: Micropelt at +49 (0) 761 156 337 0, info@micropelt.com, or visit our website at www.micropelt.com.
For more information contact:
Elisabeth Frey
Micropelt GmbH
Emmy-Noether-Str. 2
79110 Freiburg
Phone: +49 (0) 761 156 337 0
Fax: +49 (0) 761 156 337 21
E-mail: elisabeth.frey@micropelt.com
