Press Release Summary:
Model TSB-21 tests up to 2.2 lb of ICs to Mil-Std 883, while Model TSB-51 tests up to 4.4 lb. Hot bath temperature can be set to 392Â°F, while cold bath temperatures go as low as -86Â°F. Chambers integrate fluid recovery system to reduce perfluoropolyether fluid consumption, separation filter to remove water from thermal fluid, and refrigerated cooling ring to limit evaporative losses. They use ozone-friendly HFC refrigeration circuit and include programmable, touchscreen controller.
Original Press Release:
New Chambers Make Liquid-to-Liquid Thermal Shock Affordable for Semiconductor Testing
Semiconductor manufacturers have considered liquid-to-liquid thermal shock testing too expensive, despite its proven effectiveness, due to the continual loss of costly testing fluids. The improved TSB liquid-to-liquid thermal shock test chambers from ESPEC significantly reduce testing costs by limiting the loss of expensive perfluoropolyether thermal fluid. Compared to prior models, the new series also features greater energy efficiency, larger test capacity, reduced installation space, and simplified programming. The new thermal shock chambers have been built to meet the demanding test requirements of Mil-Std 883 method 1011.9, which is also a common industrial standard for semiconductor devices.
The two new models can test 33% more product: the TSB-21 can test up to 1.0 kg (2.2 lb) of ICs to Mil-Std 883, while the TSB-51 can test up to 2.0 kg (4.4 lb). The hot bath temperature for both models can be set up to 200oC (392oF), while the cold bath temperatures can go as low as -65oC (-86oF). Custom sizes are also available.
The new chambers reduce perfluoropolyether fluid (brands include Galden and Fluorinert) consumption by up to 65% by integrating a fluid recovery system. The TSB-51 model, for example, uses 1.4 grams of fluid per test cycle, compared to 3.9 grams per test cycle for the prior model. For a 1,000 cycle test, the fluid cost is US $ 150, compared to $ 420 for the prior model. The savings are even more significant for users of older chambers that have no fluid recovery systems.
"We've heard about users without recovery systems on their liquid thermal shock chamber spending up to $ 20,000 a year to replace fluids," says Allyn Arendsen, Sales Administrator with ESPEC. "With the new TSB series, our clients are expecting fluid replacement to be less than $ 1,500 a year. We think that the dramatically lower operating cost will make this type of test worth reconsidering to improve semiconductor packaging."
The recovery system reduces fluid loss through enhanced airtightness, preventing leakage of evaporated thermal fluid from the test area. A fan draws air to a condensing coil that turns evaporated fluid into a liquid, returning it to the baths. The units also include a separation filter for removing water from the thermal fluid. A refrigerated cooling ring at the top of the hot bath helps limit evaporative losses.
TSB-series chambers use a new ozone-friendly HFC refrigeration circuit that reduces energy consumption, saves space, and reduces weight, compared to prior models. Improvements in the refrigeration design have reduced power consumption by 52%, and noise levels to as low as 61 dB. The refrigeration change also reduces chamber footprints more than 15%, while cutting weight.
ESPEC's unique SCP-220TS programmable controller is standard equipment on the TSB-series chambers. The color touch-screen controller comes with an intuitive screen interface that makes set-up programming and test monitoring simple. Expanded interface options allow chamber communication and control from an external PC.
Liquid-to-liquid thermal shock testing is typically conducted to apply very strong, repetitive thermal stress to test pieces. It can model a product's ability to withstand thermally-induced size changes, crack resistance, herme tic integrity, and changes in electrical properties. This form of testing provides a very rapid temperature shock recovery of conditions, and it can significantly reduce testing time by requiring shorter soaks and less cycles.
ESPEC NORTH AMERICA is a division of ESPEC CORP., the world's largest manufacturer of environmental test chambers. ESPEC has been manufacturing test chambers in the U.S. since 1983, and the company's product line includes more than 150 test chamber models. ESPEC test chambers are used by manufacturers of electronics, semiconductors, telecommunications, automotive parts, and many other industries. ESPEC's U.S. manufacturing, sales, and service are headquartered in Grand Rapids, Michigan.
For more information about the new TSB-series thermal shock test chambers, call ESPEC at 877-463-7732 (toll-free) or 616-878-0270, fax 616-878-0280, or go to www.espec.com.