Tanaka Precious Metals Begins Sale of Three High-Functional Bonding Wire Products


Tokyo - Tanaka Holdings Co., Ltd. (a company of Tanaka Precious Metals) today announced that Tanaka Denshi Kogyo K.K., which boasts the world's leading share in the manufacture of bonding wire (wiring material), will begin sales of one ultra-reliable gold wire and two copper wire products on January 13.

Of these, the GPH is a gold alloy bonding wire for halogen-free resin that reduces the burden on the environment, and for the first time in the world, is able to maintain connection reliability for up to 4,000 hours under the high temperature of 175 degrees Celsius, which is double the time for existing products. It is perfect for wiring of electronic components requiring high reliability such as those used in automobiles. In addition, the company will begin selling CFB-1 copper wire, which offers stable connectivity that could not be achieved with copper wire in the past, and CHA copper wire for next-generation power devices, which is able to be used as a substitute for thick aluminum wire. The features of the products are as follows.

GPH Gold Wire - Wire for halogen-free resin that provides double the reliability of existing products and is perfect for automotive use

GPH is an ultra-reliable gold alloy bonding wire that is the world's first semiconductor halogen-free resin bonding wire able to maintain connection reliability for up to 4,000 hours even under the high temperature of 175 degrees Celsius, which is approximately double the time for existing products.

At present, the use of halogen-free materials in resin for sealing semiconductors and in circuit boards is spreading in the semiconductor market to reduce the burden placed on the environment by products and materials. Reliable bonding wire to date faced voids in connections when the time exceeded 2,000 hours under the high temperature of 175 degrees Celsius, causing inability to maintain conductivity, and this led to a major cause of failures of semiconductors.

Through inclusion of metal that has appropriate affinity for gold, GPH can optimize the speed of dispersion of metal in connections, enabling significant reduction of voids in semiconductors using halogen-free resin. In addition to electronic equipment such as automotive engine controls and car navigation systems, it is perfect for semiconductor wiring in equipment requiring high reliability, such as industrial equipment, and available in wire diameters of 15-38 micrometers.

CFB-1 Copper Wire - Wire enabling stable connections for use in general-purpose equipment such as personal computers and smartphones

CFB-1 is a bare copper wire to offer flexible adhesion with excellent connectivity through the optimization of material composition and surface properties, and reduces chipping and stitch bonding (wire connections to circuit boards) peeling that leads to reduced yields in semiconductor manufacturing. Conventional bare wire had difficulties with stable continuous bonding due to issues such as connection strength falling by approximately 20% caused by the wear of capillaries (microscopic tubes containing wire) after 1 million connections.

CFB-1 faces no decrease in connection strength even after 1 million connections, enabling stable continuous bonding, which greatly improves yield in semiconductor production lines. Furthermore, it can be used as a substitute for CLR-1A copper wire which utilizes palladium coating on its copper surface, providing a cost reduction of approximately 30% compared to CLR-1A. It is perfect for use as wiring material in the ICs (integrated chips) and LSIs (large-scale integrated circuit) in general-purpose equipment such as personal computers, smartphones, AV equipment and game consoles, and available in wire diameters of 18-70 micrometers.

CHA Thick Copper Wire for Power Devices - Can be used as a substitute for thick aluminum wire to support larger currents

CHA is a thick copper wire able to be used as a substitute for the thick aluminum wire that is widely used today as wiring in large-current semiconductors such as those use in power devices. Tanaka Denshi Kogyo, succeeded in the practical implementation of copper wire for power devices by using its special processing devices and annealing devices to enable the uniform placement of microcrystal particles, which had been difficult in simple copper wire processing.

The melting point of aluminum is low at only 660 degrees Celsius, which leads to fusing caused by the flow of large currents, but copper has a high melting point of 1,083 degrees Celsius and lower electrical resistance than aluminum, enabling CHA with the same wire diameter to have electrical conductivity increased by approximately 40% and the fusing current increased by approximately 30%. It is available in wire diameters of 200-500 micrometers.

Ultra low-loss power elements, such as silicon carbide (SiC) and gallium nitride (GaN), used in next-generation power devices require support for large currents under high temperatures. In particular, copper wire able to support larger currents under higher temperatures than aluminum is highly expected to be used as the wiring material in IGBT(*) performing electrical control of hybrid cars and electronic vehicles, and the company will work to expand sales of CHA as a substitute for thick aluminum wire.

Tanaka Denshi Kogyo currently has a 40% share in the world bonding wire market, and aims to raise this to 50% by the latter half of 2014. These three products are aimed at increasing market share through the replacement of existing products, and the company has set a sales target of 400 million yen per month.

Tanaka Denshi Kogyo has scheduled to display these three products at the 41st INTERNEPCON JAPAN, which is Asia's largest exhibition for electronics manufacturing and mounting technologies, held at Tokyo Big Sight (Koto-ku, Tokyo) over three days from January 18 (Wed) until January 20 (Fri). Technical staff will constantly be on-site in the exhibit booth (West 6-12) to respond to interviews.

*IGBT: Insulated gate bipolar transistor. A bipolar transistor in which a field-effect transistor is embedded in the gate section. As it is able to handle large electrical currents in voltage control, it is used in high-power switching.

Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Hideya Okamoto, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees in consolidated group: 3,456 (FY2010)
Net sales of consolidated group: 891.0 billion yen (FY2010)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: www.tanaka.co.jp (Tanaka Precious Metals), pro.tanaka.co.jp (Industrial products)

Tanaka Denshi Kogyo K.K.

Head office: 22F Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Yasushi Kasahara, President & CEO
Incorporated: 1961
Capital: 1,880 million yen
Employees in consolidated group: 124 (FY2010)
Net sales of consolidated group: 36,37 billion yen (FY2010)
Businesses: Manufacture of high-purity bonding wire (gold, gold alloy, aluminum, aluminum-silicon, copper, etc.)
Website: http://www.tanaka-bondingwire.com/

About the Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.
o Tanaka Holdings Co., Ltd. (pure holding company)
o Tanaka Kikinzoku Kogyo K.K.
o Tanaka Kikinzoku Hanbai K.K.
o Tanaka Kikinzoku International K.K.
o Tanaka Denshi Kogyo K.K.
o Electroplating Engineers of Japan, Limited
o Tanaka Kikinzoku Jewelry K.K.
o Tanaka Kikinzoku Business Service K.K.

Press inquiries
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
e-mail: tki-contact @ ml.tanaka.co.jp

About Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.
o Tanaka Holdings Co., Ltd. (pure holding company)
o Tanaka Kikinzoku Kogyo K.K.
o Tanaka Kikinzoku Hanbai K.K.
o Tanaka Kikinzoku International K.K.
o Tanaka Denshi Kogyo K.K.
o Electroplating Engineers of Japan, Limited
o Tanaka Kikinzoku Jewelry K.K.
o Tanaka Kikinzoku Business Service K.K.

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