Speedline Technologies to Preview VectraES(TM) Wave Soldering System at ATExpo 2006
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ROSEMONT, Ill., Sept. 25 -- Speedline Technologies unveils its new VectraES wave soldering system at ATExpo, booth #5702. The VectraES is the latest example of the firm's continued commitment and leadership to the traditional in-line wave soldering market.
New VectraES Wave Soldering System
Speedline's VectraES wave soldering system is the latest addition to Electrovert's wave soldering product line as it joins the industry-recognized VectraElite(TM) and Electra(TM) platforms. The VectraES provides exceptional system-wide accessibility, an advanced control system, and innovative sub-system technologies designed for today's lead-free environment. The VectraES will soon become the wave soldering system of choice for low- to medium-production environments as it provides an ideal balance between system performance, functionality, and low cost of ownership.
In addition to its new VectraES platform, Speedline will be highlighting new subsystem technologies during this year's show.
o ServoSpray(TM) Launched at ATExpo 2006
ServoSpray from Speedline Electrovert complements the company's spray fluxer product lineup; the industry's most comprehensive offering. This servo-controlled reciprocating spray fluxing system features an air atomized spray head, pressure tank flux supply system, self-cleaning nozzle capability, and the ability to spray in one or both directions via recipe control. The system provides Speedline Electrovert customers with a cost-effective method of applying flux as it delivers positive hole penetration and spray uniformity for a wide range of fluxes at a competitive price.
o Low Mass Forced Convection Preheat Technology Launched at ATExpo 2006
The VectraES will feature Speedline Electrovert's latest in preheat technology; its Low Mass Forced Convection preheat module. This easily accessible one-piece module provides exceptional thermal performance, ensuring minimized cross board as well as top to bottom product delta T's.
o UltraFill(TM) Nozzle Technology
At 40% wider than the traditional tin/lead nozzles, the UltraFill Nozzle increases both contact length and dwell time. Additionally, for dual wave applications, the spacing between the chip and laminar nozzle is reduced, resulting in less temperature drop between the two waves. With the addition of the Nitrogen Shroud, the UltraFill Nozzle may be run in an air or nitrogen environment as determined by the specified recipe (no need to change nozzles). The shroud lifts for easy maintenance and dedrossing -- without nozzle removal. The resulting benefits of the UltraFill Nozzle include: reduced bridging, reduced dross generation, reduced maintenance, and improved hole fill. Speedline Electrovert's UltraFill Nozzle is today's industry benchmark when it comes to lead-free nozzle technology.
For more information, visit Speedline Technologies at ATExpo in booth #5702, or contact your Speedline distributor or representative. Reach Speedline Technologies directly at 1-508-520-0083 or www.speedlinetech.com/.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands -- Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan's "2005 Surface Mount Technology Company of the Year."
For more information, visit: www.speedlinetech.com/ or contact Speedline at:
o USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com;
o Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: info.europe@speedlinetech.com;
o Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com.
CONTACT: Steve Martin of Bold Communications for Speedline Technologies, +1-617-909-5363, steve@wearebold.com
