Solerball Pins are available in .040 and .062 in. dia.
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Press Release Summary:
Pins with Solderball Pin(TM) technology automatically adjust for coplanarity variances as high as .015 to .020 in. Designed with copper peg on one end and solderball on other, they can be inserted into daughter-card PCBs, which is then placed onto motherboard PCB and reflow soldered. Their tapered peg design assures insertion and consistent seating on daughter-card PCB. Integrated insulator collar prevents unwanted wicking of solder along length of pin.
Original Press Release:
Autosplice's Solderball Pin(TM) Technology Provides an Automation-Friendly, High-Coplanarity SMT Methodology for Interconnecting Parallel Stacked PCBs
San Diego, CA. - - Autosplice has introduced a new SMT interconnect technology, known as Solderball Pin, which brings together the advantages of automation and the flexibility of individually placed pins, along with solderball array technologies. The result is a robust SMT interconnect technique that can be discretely placed for maximum design flexibility and manufacturing efficiency while also automatically adjusting for coplanarity variances as high as .015" to .020". The Solderball Pin concept is a logical outgrowth of Autosplice's on-going leadership in the creation of efficient, adaptable processes for implementing interconnections between parallel stacked PCBs, such as those used in power device modules and/or daughter-board to motherboard assemblies.
Solderball Pins provide an improvement over conventional through-hole pins that have typically been used for board-to-board interconnects but which have also presented significant process challenges, such as the need for specialized insertion equipment plus difficulties in coplanarity when mating boards together. Designed with a high conductivity copper peg on one end and a solderball on the other, Solderball Pins can be efficiently inserted into the daughter-card PCB, which is then placed on to the motherboard PCB and reflow soldered using existing processes. A tapered peg design assures easy insertion and consistent seating on the daughter-card PCB and the solderball automatically compensates for coplanarity variances as solderjoints are formed during final reflow to the motherboard PCB. An integrated insulator collar on the Solderball Pin prevents unwanted wicking of solder up the length of the pin itself while also providing sufficient pick up surface for vacuum pick and place.
Solderball Pins are packaged in standard tape & reel format to facilitate placement on high-speed in-line "chipshooter" automation equipment. Because they are discrete components, Solderball Pins provide optimal design flexibility that enables the arrangement of tailored interconnect patterns to accommodate a wide range of specific requirements for different assemblies, while leveraging standards-based processes and existing capital equipment investments already in use on the production floor. In addition, the availability of Solderball Pins in the same pin diameters (.040" and .062") that are being used for today's through-hole designs will enable manufacturers to rapidly introduce and ship new SMT versions of their existing modules, using the same core manufacturing processes.
Autosplice is a manufacturer of terminals, component assemblies and applicator systems, providing automated solutions for creating electrical interconnections. Autosplice systems enable substantial cost savings and provide superior reliability over conventional connector products and assembly methods. For more information on Autosplice's products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com
AUTOSPLICE, Inc.
10121 Barnes Canyon Road, San Diego, CA 92121 USA
Tel: (858)535-0077; Fax: (858)535-0130
Email: connect@autosplice.com; www.autosplice.com
