Soldering System is built for operational versatility.
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Press Release Summary:
CondensoX series lets users adapt vapor phase soldering to manufacturing conditions. Utilizing range of handling variants, system ensures void-free soldering can be achieved in any SMD manufacturing system. Condensation reflow soldering system employs hermetically locked vacuum chamber and meets challenges of Pb-free solder alloys for small and high thermal mass PCBs. Without moving assembly during soldering process, CondensoX combines vacuum profiling and thermal profiling in one machine.
Original Press Release:
Condensation Soldering is Now More Flexible than Ever with CondensoX!
Rehm Thermal Systems is presenting its CondensoX Soldering System, which allows users to adapt vapour phase soldering to manufacturing conditions. Utilising a variety of handling variants, the unique system ensures that void-free soldering can be achieved in virtually any SMD manufacturing system.
Able to be implemented into existing SMD lines, the CondensoX-series from Rehm is an advanced condensation reflow soldering system designed to meet the challenges of lead-free solder alloys for small and high thermal mass PCBs. The CondensoX-series is based on a sophisticated design featuring a hermetically-locked vacuum chamber. Without moving the assembly during the soldering process, the CondensoX combines vacuum profiling and thermal profiling in one machine.
By enabling the operator to solder variable-sized components with small delta Ts even in the pre-heating zone, CondensoX overcomes the limitations of conventional vapour phase machines. Moreover, the unique system can also rise to the challenges of soldering in different height levels up to 100mm. CondensoX can also lower the boiling point of the media to accommodate lead and lead-free profiles in a single system. Avoiding any movement to the assembly during the soldering process, the system eliminates the risk of component movement. Lack of movement and enhanced thermal control lowers scrap rates and improves cost of ownership!
With CondensoX, the vacuum can be applied directly and without delay at the point where the required temperature is reached. High responsiveness is further reinforced by the inherent flexibility offered by the system's variety of loading options. Manual, Automatic, and High-Speed loading configurations are available for manufacturers to choose from. The CondensoXP HS features two carriers that work synchronously inside the system, cutting cycle time by almost 50%. Furthermore, the flexibility of the system enables the customer to adapt it to required workflow, meaning that flow direction is not compromised as it typically is on classical inline systems. The machine can be scaled up from a basic to a high-speed system, without compromising the process or requiring further investment. Only the handling is adapted to meet new requirements.
Commenting on the success of the CondensoX system, General Manager Rehm USA, John Bashe, explains: "Offering extensive design advantages over traditional vapour phase soldering systems, CondensoX has revolutionised the area of condensation soldering. Our customers know that with this system in their production line, they can count on highly effective heat transfer for top quality soldering results. But the flexibility offered by this system is fast-emerging as its primary competitive differentiator, helping manufacturers transform the effectiveness of existing production lines. We continue to innovate in the field of thermal systems, and the continued demand for CondensoX is evidence of our commitment to this approach."
About Rehm Thermal Systems
Rehm Thermal Systems (www.rehm-group.com) is an international supplier to the photovoltaic and electronics industries, specializing in curing, drying and firing technologies as well as convection and condensation soldering. Rehm operates vertically integrated manufacturing facilities in Germany, China, and Russia, and technical support facilities throughout Europe, Asia and North America.
