Software provides simulation of high-speed IC packages.
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Press Release Summary:
Service Pack 2, for electromagnetically-based Turbo Package Analyzer, offers user-selectable source/sink assignment for solder balls and option to assign solder balls as solder bumps. It includes ability to merge all sinks, ability to merge all sources and sinks, and alphabetized netlist for both ANF filter and analyzer. Software supports WinXP Pro.
Original Press Release:
Ansoft Announces Service Pack 2 for Turbo Package Analyzer(TM) (TPA)
Service Pack (SP) 2 for Turbo Package Analyzer (TPA), an electromagnetically based analysis tool for ultra-fast simulations of high-speed integrated circuit (IC) packages, features the following enhancements:
o Option to assign solder balls as solder bumps
o User-selectable source/sink assignment for solder balls
o Ability to merge all sinks
o Ability to merge all sources and sinks
o Alphabetized netlist for both ANF filter and TPA
o Allows pads that are the same size as vias
o Support for WinXP Pro
About Ansoft
Ansoft is a leading developer of high-performance electronic design automation (EDA) software. Engineers use Ansoft software to design state-of-the-art electronic products, such as cellular phones, Internet-access devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs), automotive electronic systems, power electronics, and fuel-cell technology. Ansoft markets its products worldwide through its own direct sales force and has comprehensive customer-support and training offices throughout North America, Asia and Europe. To learn more, please visit www.ansoft.com.
