Software integrates thermal and EMC simulation.
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Press Release Summary:
Flotherm and Flo/EMC v6 generate 2 different meshes, one optimized for thermal simulation and one for EMC simulation. Geometric feature changes in design propagate between models while leaving mesh refinements intact. Able to access web-based SmartParts3D library directly, Flowtherm allows users to create compact models that accurately describe electromagnetic signature of radiating items. Visualization in Flo/EMC enables viewing of user-defined excitation waveforms.
Original Press Release:
FLOTHERM and FLO/EMC Version 6 Improves Integration of Thermal and EMC Simulation
(August 11, 2005) - Flomerics has released Version 6 of its integrated analysis environment for physical design of electronics, with improved communication between thermal and electromagnetic compatibility (EMC) simulation. The latest Flotherm and Flo/EMC software packages further reduce the time required for integrated simulation by automatically generating two different meshes, one optimized for thermal simulation and one for EMC simulation. "Automatically generating and maintaining separate meshes for these two different physical design problems greatly simplifies things for the users, and saves time and improves accuracy by eliminating the need to re-optimize the mesh when switching from one type of analysis to the other," said Mike Reynell, Director of Marketing for Flomerics.
The need for two meshes arises from the fact that the physics are different in thermal and EMC problems so grid refinement is required in different places. Examples of critical areas in thermal models include the areas between the fins of a heat sink and regions surrounding components that dissipate a lot of power. On the other hand, critical areas for EMC simulation include seams and small openings in the enclosure where radiated emissions occur. Flotherm and Flo/EMC Version 6 make it possible for users to optimize thermal and EMC meshes independently. Geometric feature changes in the design automatically propagate between the models while leaving mesh refinements intact.
Another advantage of the new releases is that Flotherm can now access the web-based "SmartParts3D" library directly, utilizing compact models and reducing the time required for modeling and analysis. Compact models provide computationally efficient representations of components' thermal and EMC characteristics. Many manufacturers of fans, heat sinks, thermal interface materials, and other components have contributed data to the SmartParts3D library, located at www.SmartParts3D.com. Flotherm Version 6 now makes it possible to launch a web browser from within the thermal analysis software and simply click on a compact model to add it to the thermal simulation. Flo/EMC Version 6 enables users to create compact models that accurately describe the electromagnetic signature of radiating items such as printed-circuit boards. The new software is able to import and derive compact models from measured data such as EMSCAN's near-field scanner or from board-level signal-integrity tools such as Speed2000 from Sigrity, RadiaSim from SimLab, and OmegaPlus from Quantic.
Flotherm Version 6 provides a new tetrahedral object that provides a better representation of curved, thick 3D shapes such as spheres. It can also now model ambient temperatures that vary with time. The thermal simulation software also can now model angled fans and resistances and centrifugal blowers in which the air outlet is 90 degrees from the air inlet. Flo/EMC Version 6 expands external excitation mode capability by making it possible to arbitrarily define the incident angle and polarization. Visualization in Flo/EMC has been extended to enable viewing of user-defined excitation waveforms. EMC specific libraries such as sources, supports, and gaskets are also new to Version 6. Flo/EMC and Flotherm solvers will be supported with a number of 64-bit processors including AMD Athlon 64, AMD Opteron, Intel Xeon with EM64T and Intel Pentium 4 with EM64T.
When used together, Flotherm and Flo/EMC Version 6 make it possible to address thermal and EMC design in a collaborative manner. Mechanical engineers can identify thermal and EMC issues in the early stages of the design process, long before prototypes are available, and perform design studies to resolve them. Being able to address thermal management and EMC issues within a single environment also makes it possible for mechanical engineers to get a head start on the difficult design tradeoffs that are frequently required between these two disciplines. Flomerics offers a new step-by-step guide (www.floemc.com/stepbystep) that explains how engineers can integrate thermal and EMC design to help identify and resolve system-level mechanical design issues.
For more information, visit Flomerics' Web site at www.flomerics.com
