Software delivers precision measurement of PCBs.

Press Release Summary:



Elements(TM) v2.4 is designed for precision measurement of electronic assemblies in high-mix manufacturing environment. It uses library of pre-configured SMT component algorithms to create measurement routines from CAD files, and enables CAD-to-measure translation for entire families of similar parts. Individual software modules target specific measurement need such as stencil/screen, PCB, solder paste, component placement, leadframe, and component package.



Original Press Release:



NEW Elements v.2.4 Speeds and Simplifies Precision Measurement



Simi Valley, CA, March 2006 - VIEW Engineering, Inc. announces the release of Elements(TM) software version 2.4. Elements eliminates the complexity and long
set-up times associated with measurement and inspection of circuit boards and electronic assemblies. Elements is available for any of VIEW's near-line vision measurement systems, simplifying the use of precision metrology for specific electronic assembly applications.

VIEW's Elements software is specifically designed for precision measurement of circuit board and electronic assemblies in a high mix manufacturing environment. Elements uses a library of pre-configured SMT component algorithms to automatically create measurement routines from CAD Files. No time-consuming programming is required - simply import the CAD file, and the routine is ready for measurement. Elements allows part changeovers to be set up in minutes, not hours.

Elements maximizes throughput by optimizing the inspection sequence, enabling hundreds or thousands of features to be measured in minutes. Elements also enables CAD-to-measure translation for entire families of similar parts.

Elements is made up of individual software modules, each targeting a specific measurement need within the electronic assembly process:

Stencil/Screen
Measure incoming and production stencils (after cleaning) to ensure the dimensional integrity of apertures and to identify blockages.

PCB
Measure holes, pads, and vias on multi-layer printed circuit boards. Also measure layer registration, a critical concern for fabricators.

Solder Paste
Measure solder paste registration with respect to pads on the PCB. Solder paste volume and epoxy glue dot registration are quickly measured.

Component Placement
Measure slugs on glass to verify placement machine accuracy according to IPC 9850. Also measure the position and orientation of actual components on glass, on boards, and in paste.

Leadframe
Measure leadframe features including lead size, position, angle, tilt, twist, and coplanarity.

Component Package
Measure wirebond features including ball diameter (or wedge major/minor axes) and bond-to-pad registration. Measure package features (of QFPs, BGAs, CSPs, Flip Chips) including lead (or ball) position, height, spacing, device coplanarity, and seating plane.

About VIEW Engineering, Inc
VIEW Engineering, Inc., a Quality Vision International company, offers video and laser-based dimensional measurement systems for electronics assembly, data storage, semiconductor, telecommunications, fine machining, medical, aerospace, and other high precision applications. VIEW is an industry leader in machine vision technology, lighting, optics, pattern recognition, edge and flaw detection, precision motion capabilities, and self-programming metrology software.

Company Contact
VIEW Engineering, Inc.
1650 N Voyager Avenue
Simi Valley, CA 93063
805-578-5000
877-767-VIEW (8439) (toll-free)
Info1@vieweng.com
www.vieweng.com

VIEW Engineering o 1650 N. Voyager Ave. o Simi Valley, CA 93063 o (805) 578-5000

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