Simulation Software aids RF/microwave and antenna design.
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Press Release Summary:
MicroStripes v7.5 integrates with Microwave Office® circuit design software, and enables users to import desired excitation waveform during modeling process, run file simulation, and evaluate results without post-processing. Ground planes can be addeed with very little additional computational time. Capable of computing and visualizing nearfield signals from RFID tags, software also includes SmartPart ferrite tile model to reduce solution time for test chambers.
Original Press Release:
New MicroStripes Version 7.5 Enables Excitation with Specific Waveform
(November 7, 2006) -- Flomerics has introduced version 7.5 of its MicroStripes 3D EM simulation solution for RF/microwave and antenna design which integrates with Applied Wave Research's (AWR®) Microwave Office® circuit design software.
"MicroStripes v7.5 operates seamlessly as a plug-in to Microwave Office, providing high-frequency RF and microwave circuit designers with proven, full-wave 3D solver capabilities required by complex high frequency design issues and time-to market cycles," said the EM Product Line Manager at Flomerics.
The new version of MicroStripes enables users to import any desired excitation waveform during the modeling process, run the simulation, and evaluate the results without any additional post-processing. This makes it possible, for example, to simulate the effect of a lightning strike, electromagnetic pulse (EMP) or electrostatic discharge (ESD) on a system using a pre-computed, analytic or measured waveform.
In version 7.5, ground planes can also be used for models without meshing all of the space between the system and ground plane. A specific algorithm accounts for the effects of the ground plane outside of the simulation domain, substantially reducing solution time.
MicroStripes 7.5 reduces the computational resources required to model ferrite tiles by providing its unique SmartPart compact model methodology of ferrite tile absorber which incorporates the effects of the tiles into the simulation without having to include them in the mesh. In a recent benchmark of an anechoic chamber performed by Siepel, the ferrite tile SmartPart reduced solution time by a factor of 15 without sacrificing accuracy.
Highlights of MicroStripes version 7.5 include:
o Integration with AWR's Microwave Office providing circuit designers with advanced design-flow and access to powerful 3D, full-wave time domain simulation.
o The use of any waveform to excite the model.
o The new ability to add a ground plane with very little additional computational time by eliminating the need to mesh the space between the emissions source and ground plane.
o Unique SmartPart compact model of a ferrite tile greatly reducing the solution time for many test chambers.
o The ability to compute and visualize the nearfield signals from any emissions source such as radio frequency identification (RFID) tag.
For more information, visit the MicroStripes Web site at www.microstripes.com
About MicroStripes
MicroStripes (http://www.microstripes.com) 3D electromagnetic simulation and analysis solution software uses the Transmission Line Matrix (TLM)-time domain method for solving Maxwell's equations, proven for its computational efficiency, stability and unconditional accuracy. MicroStripes is widely used to design antenna, assess their installed performance, RF/microwave components, Radar Cross-Section (RCS), EMC, EMI/EMP and lightning effects on vehicles, ships and aircraft, and to predict absorption of EM fields in human tissue.
About Flomerics
Flomerics (http://www.flomerics.com) is a world-leading player in the rapidly expanding field of virtual prototyping; the provision of software enabling engineers to test virtual models of their equipment by computer simulation before building physical prototypes. The markets that Flomerics currently addresses with its suite of simulation software and associated services include:
o An Integrated Analysis Environment (IAE) for the Physical Design of Electronics encompassing the following products:
System level Thermal Management (FloTHERM)
Board level Thermal Management (FloPCB)
Electromagnetic Compatibility (FloEMC)
o Package level Thermal Characterization (FloPACK & T3Ster)
o HVAC Design & Building Ventilation (FloVENT)
o Microwave, RF and Antenna System Design (MicroStripes)
Flomerics Inc.
US Headquarters
4 Mount Royal Ave., Suite 450
Marlborough, MA 01752
Tel: +1 (508) 357 2012
Fax: +1 (508) 357 2013
E-mail: info@flomerics.com
Web site: www.flomerics.com
FLOMERICS LIMITED
81 Bridge Road, Hampton Court
Surrey KT8 9HH, England
Tel: +44 (0) 20 8487 3000
E-Mail: info@flomerics.co.uk
Website: www.flomerics.com
