Silicone Encapsulant offers thermal conductivity.
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Press Release Summary:
Tra-Bond 813J01 offers thermal conductivity constant of 1.1 W/M/°K, making is suited for encapsulating heat generating devices such as transformers, thermistors or power sources, and pour-in-place heat sinks. Operating temperature is 260°C, but with Tg of -120°C, Tra-Bond 813J01 can deal with stress issues and mismatched CTEs. It can be cured at room temperature, or in only minutes at elevated temperatures. Working life is 100 min.Original Press Release:
Tra-Bond 813J01
The Low Stress Thermally Conductive Encapsulant
This silicone encapsulant offers measured operating temperatures of up to 260°C. However, with a Tg of -120°C, Tra-Bond 813J01 is great for dealing with stress issues and mismatched CTE's. Tra-Bond 813J01 offers a thermal conductivity constant of 1.1W/M/°K. This makes it great for encapsulating heat generating devices such as transformers, thermistors or power sources, and pour-in-place heat sinks.
Tra-Bond 813J01 offers flexibility in it's cure schedule as well; it can be cured at room temperature, or in only minutes at elevated temperatures. This adhesive offers a working life of 100 minutes.
Does Tra-Bond 813J01 look like something you want to try? Call Tra-Con for free samples. Tra-Con has a wide variety of adhesives to meet all your application needs. If you have application problems, contact one of our engineers for answers.
Call 1-800-TRA-CON-1, or visit the web at www.tra-con.com.
