Press Release Summary:
Manufactured in 130 nm CMOS technology, TLK3118 provides bi-directional, point-to-point data transmission for backplane and front plane connections. Discrete device is capable of error-free transmission over 80 in. of standard backplane trace. Flexible, redundant XAUI serial transceiver provides complete XGXS (10 Gigabit extended sublayer) function and performs parallel-to-serial conversion, serial-to-parallel conversion, and clock extraction functions for physical layer interface.
Original Press Release:
TI Introduces 10GE (XAUI) Backplane SERDES Capable of Error-free Transmission Over 80 Inches of Standard Backplane Trace
DALLAS (March 16, 2004) - Providing high-speed, bi-directional, point-to-point data transmission for backplane and front plane connections, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced a new discrete serializer/deserializer (SERDES) capable of error-free transmission over 80 inches of standard backplane trace. Manufactured in TI's advanced 130nm CMOS technology, the TLK3118 is a flexible, redundant XAUI serial transceiver compliant with the IEEE 802.3ae specification for 10 Gigabit Ethernet. Ideal for local, metropolitan and wide area network applications, the device enables designers to reduce board space and design time. (See www.ti.com/sc04071 for more information.)
Within backplane designs, the TLK3118 enables higher port density systems by reducing board space, system costs and power consumption, ultimately packing more high-speed channels/ports in less space, in turn cutting costs for network service providers. The device performs the parallel-to-serial conversion, serial-to-parallel conversion and clock extraction functions for a physical layer interface. It provides a complete XGXS (10 Gigabit extended sublayer) function with a redundant serial (XAUI) port. Redundancy is critical to communication equipment makers that want to provide systems with high availability and superior Quality of Service (QoS). The serial transmitter is implemented using differential current mode logic with integrated termination resistors. The device employs state-of-the-art transmit and receive equalization technology for superior signal integrity over industry standard media such as FR4 backplanes. This equalization technology has enabled TI to achieve error-free data transmission over 80 inches of backplane with this device.
About TI's 130nm CMOS Technology
TI's advanced 130nm process technology enables TLK3118 to achieve extremely low power dissipation of 1.6W (with HSTL termination turned off) at 3.125 Gbps. The device has been developed using the proprietary serial link core technology within TI's 130nm standard cell library. The use of common serial link core intellectual property across both ASIC and discrete SERDES solutions provides customers the unique opportunity to choose between discrete and ASIC-based solutions as they incorporate TI's advanced serial link technology. The capability to deliver both discrete and ASIC-based serial link solutions enables TI to service every phase of a customer's product life cycle with consistent and proven technology.
The TLK3118 is sampling now to partner customers, with planned production in 3Q04. The device is packaged in a 21x21mm, 400-ball, 1mm ball pitch Ball Grid Array (FC-BGA) package. Planned pricing in quantities of 1,000 is $60 per unit.
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.