Press Release Summary:
Intended for applications where data protection is crucial, 64 GB SSD BGA (32 x 28 mm) overcomes malicious attack concerns with factory firmware lockdown technology that prevents covert firmware repurposing. Self-encrypting drive delivers multiple key management methods and security features based on Armor™ III processor technology. For sensitive applications, encryption key can be erased in <30 msec, andÂ second security layer can be activated to erase entire storage media in <10 sec.
Original Press Release:
Microsemi Introduces Second Generation Highly Secure 64GB Solid State Drive
Company Continues to Increase Leadership Position in Expanded Security Products Where Data Protection is of Utmost Importance
ALISO VIEJO, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today introduced its second generation highly secure 64 gigabyte (GB) solid state drive (SSD). With data security threats increasing, Microsemi specifically designed its latest SSD for market applications where data protection is of the utmost importance. It overcomes malicious attack concerns with Microsemi's unique factory firmware lockdown technology to prevent covert firmware repurposing. Offered in a 32mm x 28mm ball grid array (BGA) package, the new SSD is highly optimized for embedded computers in harsh environments.
Microsemi's new 64GB SSD is a self-encrypting drive that delivers multiple key management methods and advanced security features based on the company's proven Microsemi Armor(TM) III processor technology. For sensitive applications, the encryption key can be erased in less than 30 milliseconds (ms) and a second security layer can be activated to erase the entire storage media in less than 10 seconds, virtually rendering data forensically unrecoverable.
"Embedded computing applications have increased the need for compact small form factor, highly secure and trusted data-at-rest protection," said BJ Heggli, general manager for Microsemi's memory and storage business. "We introduced this latest 64GB SSD in our BGA package to expressly meet the data security and extreme reliability requirements of a growing number of embedded applications. And because Microsemi owns the processor Armor III technology, customers are also assured of critical long-term availability."
"Our latest 64GB SSD in the rugged BGA package continues to demonstrate Microsemi's commitment to designing and delivering the world's leading rugged and secure storage solutions," said Charlie Leader, Microsemi vice president and executive manager. "In addition, this latest SSD is designed and assembled in the United States in Microsemi's trusted facility, providing an extra level of confidence for our customers."
Microsemi 64GB SSD BGA Features:
-- Capacity: 64GB non-volatile storage using reliable, long life SLC NAND flash
-- 65 MB/s sustained read/write speeds
-- Hardware-based AES-256 XTS encryption providing strong sensitive data protection (FIPS 197 #3095)
-- Key management: multiple modes, including loadable AES encryption keys
-- DS-101 key fill port with KEK and black key support
-- Hardware authentication (optional) enables higher levels of security
-- TRRUST-Purge clears encryption key in less than 30ms
-- Fast erase capability: hardware-based fast clears the entire drive in less than 10 seconds
-- High-reliability: developed to endure harsh environments, industrial temperature
-- Obsolescence management: Microsemi Armor III security management processor for long life
-- Fast sanitization speed
-- Self-destruct capability
-- U.S.-made with full BOM and assembly control
More information about Microsemi's SSD BGA products is available at: http://www.microsemi.com/solid-state-drives/solid-state-drives. To request a full datasheet, please contact: firstname.lastname@example.org.
Microsemi has full design, manufacture and test capabilities for a wide variety of multiple chip packages (MCPs), commercial-off-the-shelf (COTS) memory, microprocessors and combination MCPs for demanding applications.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
CONTACT: Farhad Mafie, VP Worldwide Product Marketing, 949.380.6161, or Beth P. Quezada, Communications Manager, 949.380.6102, Email: email@example.com