Sanmina-SCI to Demonstrate a High-Speed Backplane Capable of 12.5 Gbps Data Transmission Rates at DesignCon 2007

Leading EMS Provider Will Also Showcase Novel PCB and Backplane/Midplane Signal Integrity Solutions

SAN JOSE, Calif., Jan. 29 / - Sanmina-SCI Corporation (NASDAQ:SANM), a leading global electronics manufacturing services (EMS) company, today announced that the Company will unveil some innovative approaches to improving the signal integrity of high-speed data links at DesignCon 2007, to be held January 31 through February 3, at the Santa Clara Convention Center in Silicon Valley. Sanmina-SCI will be located in the PCB Technology Pavilion, booth number 607. Several other exhibitors will also demonstrate Sanmina-SCI built printed circuit boards (PCBs) and backplanes operating with their products.

"For DesignCon 2007, we plan on introducing some novel methods for improving signal integrity performance of high-speed serial data links operating at data rates in excess of 6.125 Gbps," explained George Dudnikov, Senior Vice President and Chief Technical Officer for Sanmina-SCI's PCB and Backplane Divisions. "SI and interconnect design engineers often tend to focus on high-speed transmission data rates as the primary design goal. However, at very high data rates, distortions can negatively impact signal quality (i.e., the Bit Error Rates) leading to unsatisfactory design compromises. We have developed via design and dielectric material technology which can result in Bit Error Rates as low as 10E-18. We will also have a demonstration of a fully functional, production-level backplane capable of operating at 12.5 Gbps with real-time BERT monitoring. Plus, we will demonstrate the benefits and advantages of backdrilling technology."

Sanmina-SCI will be launching a new patent pending technology at DesignCon called MTS-Via(TM) which utilizes embedded passives to eliminate the need for backdrilling via stubs on high-speed PCBs and backplanes. MTS, which stands for "Match Terminated Stub," incorporates a printed resistor on internal layers of the PCB to terminate the stub and eliminate the parasitic resonances that would otherwise occur. Backdrilling is an effective way of doing this but can add significant complexity and cost to the PCB, especially when the number of high-speed signals increase. MTS-Via(TM) will work in tandem with another complementary technology being promoted called Opti-Via(TM) which optimizes internal layer features for improved signal integrity.

The Sanmina-SCI booth will be staffed with key technologists and research personnel to address issues and problems facing designers in the fields of High-Performance Laminates, Embedded Passives, Microvias and HDI, Signal Integrity, Backplane Technology and RoHS/Lead-free Compliance. Designers are invited to provide their feedback to the technical staff on hand, and to share their design issues and future needs.

Sanmina-SCI's PCB Division is a pioneering force in the PCB industry with more than 20 patents and over 20 years of experience, offering customers the latest in high-performance materials and enhanced via geometrics that significantly increase useable bandwidth and substantially decrease Bit Error Rates (BER). State-of-the-art PCB factories are strategically located in North America, Europe and Asia, offering high-end technology and efficient lower- cost manufacturing.

Sanmina-SCI's Backplane Division features highly skilled engineers and design support around the world, providing customers with passive, active and high-bandwidth backplanes. Valuable information for current and prospective customers interested in Sanmina-SCI's PCB and Backplane services can be found by visiting the PCB Fabrication section of the Company's website at .

About Sanmina-SCI

Sanmina-SCI Corporation is a leading electronics contract manufacturer serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina-SCI provides end-to-end manufacturing solutions, delivering unsurpassed quality and support to OEMs primarily in the communications, defense and aerospace, industrial and medical instrumentation, multimedia and consumer, computer and server, and automotive technology sectors. Sanmina-SCI has facilities strategically located in key regions throughout the world. More information regarding the Company is available at .

FCMN Contact:

Source: Sanmina-SCI Corporation

CONTACT: Michael Kovacs, Director, Corporate Marketing, +1-408-964-3142, or,

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