Product News:

Ruggedized Android Tablet serves mobile enterprise applications.

Press Release Summary:

Jul 22, 2014 - Protected against shock, vibration, and drops of up to 2 m, IP65-rated VIA Viega measures 10.4 x 6.8 x 0.5 in., weighs 1.5 lb, and has 10.1 in. LED backlit LCD screen with shatter-resistant, tempered glass panel. Polymer battery pack provides up to 9 hr runtime, and 1.2 GHz dual-core ARM Cortex-A9 SoC features NEON technology. Along with customizable Android 4.2 OS, tablet comes with 1 GB DDR3 DRAM, Mali-400 DP GPU, 16 GB eMMC Flash, wireless connectivity, and multiple I/O options.

VIA Technologies, Inc. - Taipei, TWN

Original Press Release

VIA Announces VIA Viega Ruggedized Android Tablet

Press release date: Jul 15, 2014

Customizable solution for a wide variety of enterprise-level mobile computing applications, including industrial, retail and transportation

Taipei, Taiwan – VIA Technologies, Inc today announced the VIA Viega, a ruggedized 10.1” Android tablet engineered to survive the rigors of the showroom floor, warehouse, construction site and other enterprise-level mobile computing environments.

The IP65-rated VIA Viega sports a durable design that protects against spills, rain, and dust. It also features shock and vibration protection that safeguards the device against drops of up to two meters, as well as a tempered glass panel to prevent shattered screens. With an extra long-life polymer battery pack and an optional highly-customizable docking station to provide extensive connectivity for external peripherals and rapid charging capabilities, the VIA Viega ensures uninterrupted operation throughout an entire working shift in even the most demanding usage scenarios. 
Powered by a dual-core ARM Cortex-A9 SoC with NEON technology, the VIA Viega delivers outstanding multimedia performance, including hardware acceleration for stunning HD product demonstration and training videos. A rich set of wireless connectivity options including Wi-Fi, GPS, Bluetooth 4.0, and NFC, as well as optional 3G for transportation or remote location scenarios, means absolute flexibility in a wide variety of indoor and outdoor deployments.

The VIA Viega features a highly-customizable Android 4.2 Operating System with enhanced security features such as hardware-assisted data encryption/decryption and built-in manageability through the VIA SMART ETK. A wide range of framework, kernel and device management customization services for the VIA Viega are also available from VIA.

“As more and more enterprises seek to increase productivity and improve customer service by equipping their staff with mobile devices, they are quickly learning that it is critically important to deploy customized solutions built to withstand the demands of their target environments rather than standard off-the-shelf products,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “With its rugged design, enhanced security features, and customization support, the VIA Viega addresses this need and provides the longevity support that enterprise level customers require.”

VIA Viega Tablet Key Features
• 1.2GHz Dual Core ARM Cortex-A9 SoC with NEON technology
•  Mali-400 DP GPU
•  16GB eMMC Flash
•  10.1” LED backlit LCD screen
•  Optional 2M Front and 5M Rear camera with auto focus support
•  Micro SIM card slot
•  Micro SD Card slot
•  2 Micro USB ports (1 for regular function, 1 for DC12V-in/COM port function)
•  1 Micro HDMI-out port
•  Wi-Fi, 3G, GPS, Bluetooth 4.0 and NFC support
• 1 Earphone jack and stereo speakers inside
•  Long-life polymer battery pack with up to 9 hours runtime
•  Android 4.2 OS with customization services available
•  265.4mm(W) x 171.5mm(H) x 12.3mm(D) (10.4” x 6.8” x 0.5”)
•  690g (1.5lbs)
•  3 year longevity support

Availability: Samples are available testing at the time of this release.

For more information about the VIA Viega Android tablet, please visit:

For images related to the release, please visit:

About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators.

VIA PR Contact

Richard Brown
(886)-2-2218-5452 #6201

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