Receptacle Connector handles high-speed telecom applications.
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Press Release Summary:
Designed to meet needs of high-density applications requiring 10 Gbps performance with up to 528 signal pins per connector, 5.5 mm Telcordia Receptacle MEG-Array connector suits transmission, access, switching, optics, and networking equipment. It is functional with 0 and 6 mm plugs, provides 300 signal contacts, and adds compatibility for 5.5 and 11.5 mm stack heights. Connector also provides stack heights ranging from 4-14 mm and multiples sizes from 81-528 signals.
Original Press Release:
FCI Extends MEG-Array® Product Line to Include 5.5mm Telecordia Receptacle Connector
FCI, one of the leading suppliers of connectors and interconnect systems, has expanded its MEG-ARRAY® product line to include a 5.5mm Telcordia Receptacle connector. An effective solution for high-speed, high-density applications that require 10Gb/s performance, the connector is ideal for use in telecom applications including transmission, access, switching, optics and networking equipment.
"We expanded the MEG-Array product line based on the needs of our customers to have a connector for higher-speed, higher-density applications," said Bavo Teunissen, global
marketing communications manager, FCI. "The combination of multiple stack heights and multiple size options optimizes design flexibility." .
The Telecordia Receptacle connector is functional with the company's existing 0mm and
6mm plugs, provides 300 signal contacts and adds the compatibility for 5.5mm and 11.5mm stack heights. This MEG-Array connector is designed to meet the needs of applications requiring 10Gb/s with up to 528 signal pins per connector. Providing stack heights ranging from 4mm to 14mm and multiples sizes from 81 signals to 528 signals, design flexibility is realized when yielding less than 1% cross-talk performance when configured differently.
All MEG-Array connectors feature FCI's Ball Grid Array (BGA) connector termination for
easy attachment to printed circuit boards using conventional reflow soldering processes.
The 1.27mm x 1.27mm BGA grid optimizes routing and electrical performance.
