Rayotek Scientific Inc's New Large Format 5-Axis Grinding System - Rapid Shaping of Small to Massive Workpieces


SAN DIEGO, California — Rayotek Scientific Inc.'s new, custom configured 5-Axis Grinding System is now installed, tested and fully operational.  Rayotek can now perform quick-turn production of small to massive, high-precision CNC ground parts from Alumina and other refractories, fused quartz, fused silica, silicon carbide, glass and sapphire.



The new 5-Axis Grinding System was designed to meet customer's needs for the rapid grinding of complex very large, high-precision parts. The system is run with Del Cam Software to ensure high precision for complex tool paths. The new Grinding System completely replaces traditional grinding technologies, which are far more time-consuming and costly.



Rayotek configured the 5-Axis Grinding System to optimize accuracy for diamond grinding hard, brittle materials and to provide repeatable accuracy for complex small to massive workpieces. The system upgrades are: A rigidized bridge, Fanuc control drives, Renishaw touch probe for in-process adjustment of tool path, onsite laser mapping for higher accuracy, and a fully temperature controlled work environment.



"We're so excited that Rayotek now offers state-of–the-art 5-Axis Grinding Services for our specialty materials.  Since we brought online our new massive grinding system, we're turning out complex ground parts much faster and with impressive precision, even for extremely large parts!" states Bill Raggio, Rayotek's President and CTO.



Rayotek, which specializes in sapphire, fused quartz, fused silica, ceramic and glass manufacturing, is now offering 5-Axis Grinding services as an addition to its existing services, which include:



• Glass, ceramic and pressure engineering services

• Molding & Slumping

• Scribe & Waterjet Cutting

• Brazing, Fusing & Sealing

• Thermal Processing

• High Pressure Testing

• Failure Analysis

• Large Format CMM



5-Axis Manufacturing Capabilities

5-Axis Grinding System Work Envelope





































Maximum Grinding

X-axis

163 in

4150 mm

Maximum Grinding

Y-axis

197 in 

5000 mm

Maximum Grinding  

Z-axis

55 in

1400 mm

Maximum Outside Diameter

 

159 in

4030 mm

Approximate Accuracy Across entire footprint* ±0.003in ±0.075mm

 

 

 



* Actual machine accuracy is determined by part design, size and material type. Greater precision can be achieved for smaller parts.



About Rayotek

Since 1992 Rayotek has engineered and manufactured sapphire, glass, fused quartz and fused silica products, enabling world-class companies to bring cutting-edge products to market.  Rayotek's expertise is creating solutions for complex customer needs and leading projects from the conceptual stage, through engineering and design, to final manufacture.


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