See the Latest DEK Advances at SMTA International
At next month's SMTA International event in Fort Worth, Texas, DEK will show visitors how its intelligent printing technology can help raise yields, increase throughput and lower costs. With brand new products that enable parallel processing capability and minimal requirements for operator intervention, DEK is moving the industry ever-closer to true 'lights-out' printing.
From booth # 207 on October 15th and 16th, DEK will showcase its newest solder paste control system, Automatic Paste Dispenser II (APD II), on board the company's award-winning Horizon 03iX print platform. Complete oversight of the dispense profile, paste volume management and dispense stroke (length) and position (x,y) can all be regulated automatically with APD II. What's more, the innovative design of APD II allows for simultaneous paste dispensing and understencil cleaning, which maximizes equipment utilization for minimal time loss. When used in combination with DEK's Paste Roll Height Monitor to verify solder paste presence, APD II enables a completely machine-controlled paste management system.
"DEK's reputation as the global printing leader has been built on consistently delivering smart technologies that advance printing efficiency and control," says Brian Smith, DEK Americas General Manager for Electronics Assembly. "These latest innovations are significant steps toward a completely hands-off print process run by extreme machine intelligence. The result is superb print outcomes."
In addition to DEK's APD II and Paste Roll Height Monitor, the company will also illustrate how multiple DEK technologies can align to offer a highly-effective print operation. Visitors to the DEK booth will see the ProDEK closed-loop offset optimization system, Grid-Lok automatic board support, ProActiv transfer efficiency-enhancing technology and the company's latest stencil advance, VectorGuard High Tension.
The ingenuity of the DEK team is what drives the development of these novel technologies and several DEK experts will be on-hand to share their vast print process knowledge. Senior Advanced Technology Specialist, Jeff Schake, will be at the DEK booth from 9:00 a.m. to 11:00 a.m. on Tuesday, October 15th and for the majority of the day on Wednesday, October 16th to help show delegates discover solutions to their printing challenges. Mr. Schake will also deliver a paper entitled "Stencil Aperture Design Considerations for 0.3 CSP Ultra-Fine Pitch Printing" on October 15th at 2:30.
"Central to delivering intelligent technology is a depth of understanding of our customers' specific requirements," says Smith in conclusion. "We realize that each process is unique and we can customize a solution with the right options to deliver maximum value and an incredibly smart, high-yield print process."
For more information or to schedule an appointment, send an e-mail to Brian Smith (firstname.lastname@example.org).
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at www.dek.com.