Power System responds to current changes in 1 µsec.

Press Release Summary:

Factorized Power Architecture power system is powered by V*I Chips that process up to 200 W in <0.25 cu in. and weigh <13 g. Ball Grid Array package has power density of 800 W per cu in. Surface mount components create flexible Factorized Power Systems with ability to operate within height of 4 mm over printed circuit board.

Original Press Release:

Vicor Introduces the V*I Chip and a New Power System Architecture

Andover, MA., April 30, 2003 -- Vicor Corporation (NASDAQ: VICR) today has introduced a new power system architecture based on an array of proprietary power conversion technologies. The new architecture, called Factorized Power Architecture (FPA), will provide power system designers with breakthrough performance
at a lower cost than attained with conventional Distributed Power Architecture (DPA), including Intermediate Bus Architecture (IBA). FPA and its enabling V*I Chips will supersede the paradigm based on "high-density" DC-DC converter "bricks" and non-isolated Point Of Load converters.

FPA is enabled by power conversion components called V*I Chips or VICs. V*I Chips efficiently process up to 200 Watts of power in a small (less than 0.25 cubic inch) and light (less than 13 grams) power Ball Grid Array (BGA) package, with power density up
to 800 Watt/in3, five times better than any competitive product. These functional building blocks will be deployed as surface mount (SMD) components to create a flexible Factorized Power system.

One VIC type, the Voltage Transformation Module (VTM), is designed to convert the Factorized Bus to the voltage levels required by the load with efficiencies as high as 97%.

The VTM will also provide input to output galvanic isolation. With an effective switching frequency of 3.5 MHz, the VTM responds to dynamic loads 20 times faster than the fastest competitive brick type converter.

Because of the inherent flexibility of Factorized Power and the
performance superiority of V*I Chips, Vicor believes that a wide
variety of systems and applications can benefit from their deployment.

For example:

Systems with advanced, high-speed microprocessors requiring on-board power at high current and low voltage can draw as much as 80 Amperes at up to 2.5 Volt from a single VTM. The VTM's ability to respond to changes in microprocessor current in less than one microsecond outperforms typical sub-MHz, hard-switching, multi-phase VRMs while at the same time reducing system complexity and cost.

Electrical and electronic systems in vehicles requiring a multiplicity of high and low voltages can benefit from the high density, high efficiency and low electrical noise of V*I Chips. The high temperature performance, thermal management versatility
and inherent ruggedness of V*I Chips should provide compatibility with harsh application environments, such as found in automobiles.

Consumer and other electronic products requiring small, lightweight and low profile power systems that are cost-effective can benefit from the VIC's ability to operate within a
height of only 4mm over the printed circuit board.

The first V*I Chip product offering will be introduced in May, 2003.

Additional Factorized Power products will be introduced at an
increasing frequency over the next several months.

VICs for FPA systems will be priced as low as 12 cents/Watt or 31 cents/Ampere. A 200 Watt PRM or an 80 Amperes VTM will be priced at $25 each in OEM quantities. V*I Chips will be shipped in JEDEC trays or taped and reeled for use with automated pick
and place equipment.

For more information on V*I Chips and Factorized Power Architecture, please visit the Vicor website at www.vicorpower.com < vicorpower.com>.

Customer Contact:
Bob Marchetti
Product Marketing Mgr.
Tel. (978) 470-2900

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