Power Distribution Units suit power-intensive servers.
Press Release Summary:
With 1U form factor, Distributed Power Interconnect products are built on IBM Interconnect Rack Architecture. They support power requirements of IBM xSeries® and high-end servers and are offered in 60 and 63 A single-phase and 32 and 60 A 3-phase versions. Modular approach to power distribution allows products to be directly attached to servers or used as front-end units. PDUs include all mounting hardware and cable brackets.
Original Press Release:
IBM Distributed Power Interconnect - High-Density Power Distribution Units for Power-Intensive Servers
At a glance
The new Distributed Power Interconnect (DPI) high-density rack-based products support the most demanding power requirements of the IBM xSeries and high-end servers. Key features include:
o 1U rack design to allow placement in the side pockets or in the EIA space
o Single- or three-phase versions
o Modular approach to power distribution; the PDUs can be used directly attached to servers or as front-end PDUs for support of large numbers of rack PDUs
IBM Interconnect Architecture - DPI:
o Speeds installations
o Simplifies cabling inside and outside of the rack
o Improves cable management
o Delivers worldwide coverage
o Offers three-year, limited warranty1
For technical support:
Call the SupportCenter at 800-IBM-SERV (800-426-7378)
or
Request technical information via the Personal Computing Division Web site at: www.ibm.com/pc
Overview
The new IBM Distributed Power Interconnect (DPI) high-density power distribution units (PDUs) are a cost-effective solution for IBM xSeries® customers looking for an efficient power distribution product for the rack environment. These PDUs provide excellent power availability with the following benefits:
o Easy to install into the rack
o PDUs include all mounting hardware and cable brackets
o Allows customers to place in the rack side pockets or in the EIA(TM) space
o Extend and enhance power support
o 60 and 63 amp single-phase and 32 and 60 amp three-phase designs maximize the current that can be delivered to the rack
o Line cord consolidation; reducing line cord saves time and cost
o Built on IBM Interconnect Rack Architecture, these products help improve rack ecosystems with their design
Competitive advantages include:
o Speedy installation
o Simple cabling
o Cost-saving design
o Improved management
o Enhances high-end support for the DPI product family
o Greater worldwide coverage
o Cost savings due to dramatic line cord reduction
Key prerequisites
These PDUs must be connected to a properly installed, region-specific, appropriate wall outlet. For more information on installation, refer to the Planning information section.
Planned availability date
November 7, 2003
1 For information on the IBM Statement of Limited Warranty, visit:
http://www.ibm.com/servers/support/machine_warranties/
Alternatively, this information is also available by calling 800-IBM-SERV (426-7378) or contacting your IBM representative or reseller. Copies are available upon request.
