Press Release Summary:
Consisting of base carrier with consumable foil, Virtual Panel Carrier enables multiple component support and alignment during screen printing and all subsequent assembly processes. Substrates are held in carrier via 4-sided tensioning mechanism and then aligned within carrier using centering system. Parts are referenced using two global fiducials, enabling transfer of VPC throughout all assembly processes.
Original Press Release:
DEK's Virtual Panel Carrier Delivers Total Process Solution for Substrate Centering and Transport
Building on the technology of its award-winning Virtual Panel Tooling (VPT) high throughput substrate imaging system, DEK has advanced this concept even further and developed Virtual Panel Carrier (VPC). A ground-breaking substrate centering and carrier technology, VPC enables multiple component support and alignment during screen printing and all subsequent assembly processes.
Traditional carrier technology used for processing small components generally requires individual component alignment and processing or the use of specialized and costly custom tooling to bring components into common alignment for printing. With all of the current systems, separate alignment processes for each component must be carried out at every process stage, thus resulting in less than ideal throughput and expense. DEK's new VPC technology alleviates these issues by enabling the components to be aligned once in the VPC for screen printing. Once this alignment occurs, no further adjustments are required for any of the subsequent assembly processes.
"The design of VPC is quite extraordinary," explains Neil MacRaild, DEK Americas General Manager. "With equal force being applied to each side of the substrate or device, centering is consistent with no chance for even slight misregistration. Plus, the system utilizes VPCs global fiducials instead of individual component fiducials, which simplifies all stages of assembly and dramatically improves UPH."
Through a unique design that consists of a base carrier with a low-maintenance consumable foil, DEK's VPC provides the stability, centering and alignment capabilities required to process multiple substrates or components in a single panel, dramatically improving throughput. Parts are placed in the carrier either manually or loaded with a placement system. Substrates are held in the carrier via a patented 4-sided tensioning mechanism and then aligned within the carrier using an innovative centering system. Parts are referenced using two global fiducials - as opposed to individual component fiducials - thus enabling the easy transfer of VPC throughout all assembly processes. The system is also scalable, allowing manufacturers to adjust component quantity for individual processing requirements.
As electronics manufacturers continue to search for ways to reduce cost and enhance productivity, VPC is providing a simple alternative to current technology. DEK's VPC enables an easy, one-time set-up for the entire assembly process, exponentially improves UPH, provides for very fast changeover, allows for streamlined equipment set ups and may eliminate the need for expensive, high-maintenance tooling.
VPC will be demonstrated from July 17 through July 19 at DEK's booth, #8811, at Semicon West in San Francisco, California. For more information or to schedule a demo appointment, please call 408-954-8582.
DEK is a global provider of advanced pre-placement manufacturing solutions and innovative deposition technologies for a wide range of electronic materials. For more information, visit DEK at www.dek.com.
Tel. +44 1305 760760