Nextest Showcases a Wide Range of Cost-Effective Test Solutions at SEMICON/Japan
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Recently introduced, the Magnum Grande and Magnum iCP provide semiconductor manufacturers with massively parallel test solutions for the high-volume consumer digital appliance market.
TOKYO, Dec. 4 // -- Nextest Systems Corporation (NASDAQ:NEXT), a leading manufacturer of automatic test equipment (ATE) for cost-sensitive semiconductors, announced that it will exhibit a wide range of test solutions at SEMICON/Japan. The conference is being held December 6-8, 2006, in the Makuhari Messe, Chiba, Japan. SEMICON/Japan is a premier venue for semiconductor equipment manufacturers to showcase their products and services to customers from Japan and the entire Asia-Pacific region.
Tim Moriarty, Nextest's Vice President of Sales and Marketing, commented, "Japan is a very important market for Nextest and we are pleased to attend this conference for our third consecutive year. We believe it is important to bring actual test equipment to the conference, in order to demonstrate, firsthand, the throughput advantages of our products. We appreciate the opportunity to show our innovative solutions and how they contribute to significantly reducing test costs for semiconductor manufacturers."
On display at SEMICON/Japan, Nextest will showcase the following test solutions in Booth 913, Hall 9-D:
Magnum iCP(TM)
Focused on the CMOS Image Sensor (CIS) device market, Magnum iCP is the most recent addition to the Magnum test platform. This test system will be on demonstration, integrated with an Inter Action OP385 Illuminator and a Semics Opus II wafer probing system. Magnum iCP offers CIS manufacturers the high level of efficiency and capacity required to test CIS devices in volume, and cost effectively. Applications for image sensors range from cellular phones and digital cameras, to web cams, PDAs, security systems, and an ever-growing list of consumer products.
The Magnum iCP integrates logic test capability with optimized image capture and processing hardware. A high-quality light source, along with a contemporary 12-inch wafer probing system, provides users with a complete solution for probing up to 40 (forty), 256-mega pixel CIS devices in parallel.
Magnum Grande(TM)
Also introduced this year, Nextest's Magnum Grande will be on display integrated with a TechWing TW-380 handler testing 720 NAND Flash devices in parallel. With configurations available up to 7,680 I/O pins and 960 sites, the Grande's twelve-chassis system provides IC manufacturers with the maximum test capacity available in a single test head today. Each Magnum system is built from a set of "Site Assemblies" that contain all of the data generation, error processing, timing and DC resources required to test a wide variety of devices, including both NAND and NOR Flash memories. Each Site Assembly also includes an embedded PC for high efficiency and local control of the test process, keeping parallel-test overhead to the lowest level in the ATE industry.
Magnum PV(TM)
Magnum PV is the smallest version of the Magnum family of test systems, targeted towards engineering and lower-volume manufacturing test. Nextest will demonstrate the Magnum PV's ability to test multiple microcontrollers in parallel.
The Magnum PV also provides test engineers with an affordable solution for their test program development that is completely compatible with their production test systems.
ABOUT NEXTEST
Nextest Systems Corporation is a low-cost leader in the design and manufacture of automatic test equipment (ATE) for Flash memory and System-On- Chip semiconductors. Nextest's products address the growing demand from manufacturers for ATE with increased throughput, functionality and reliability, while reducing time to market and cost of test. Nextest has shipped over 1,600 systems to more than 60 semiconductor companies worldwide. Further information is available at www.nextest.com/.
Source: Nextest Systems Corporation
Web site: www.nextest.com/
