New SIPLACE TX Placement System with SIPLACE Tray Unit

Press Release Summary:

• Equipped with two stationary high-end camera systems
• OSCs measuring up to 200x110x25 mm and weighing up to 160 grams
• Applications include mobile devices and increasingly complex automotive solutions

Original Press Release:

Automatic OSC Feeding for The Siplace TX

Suwanee (USA), February 22, 2023 – Although the processing of odd-shaped components at the end of the line usually accounts for only about ten percent of the entire SMT process, it represents the majority of the challenges in placement operations. With a smart high-performance solution from technology leader ASMPT, the company’s SIPLACE TX high-speed placement systems can now also be used as end-of-line machines for the automated processing of odd-shaped components (OSCs), replacing expensive and slow robotic solutions or manual work. The SIPLACE Tray Unit enables the automatic, uninterrupted feeding of components from up to 82 JEDEC trays. And the associated seamless traceability of products, components and batches ensures total auditing security, which is particularly important in sensitive areas such as the automotive sector.

“With its proven Waffle Pack Changer and Matrix Tray Changer, ASMPT has long offered the option of automatically supplying odd-shaped components (OSCs) to the highly flexible SIPLACE SX and the high-volume SIPLACE X S. Due to design limitations, this was previously not possible for the SIPLACE TX,” explains Petra Klein-Gunnewigk, Senior Product Manager at ASMPT. “With the new SIPLACE Tray Unit we fulfill the wish of many electronics manufacturers to make this machine, which is highly valued for its impressive floorspace performance, fit for automated, highly efficient and more productive end-of-line processing. As a result, SIPLACE TX users can now balance their lines even more effectively while gaining valuable space on the shop floor and increasing their flexibility by integrating processes that previously had to be handled offline – with all the advantages that our Open Automation concept delivers.”

Ready for OSC processing

To ensure the correct processing of odd-shaped components in a single step, the SIPLACE TX can now be equipped with two stationary high-end camera systems for use with two TwinHeads or a placement head combination of a CPP and a TwinHead. With its great selection of special nozzles and grippers, the TwinHead makes it possible to place OSCs measuring up to 200 mm × 110 mm × 25 mm (L × W × H) and weighing up to 160 grams. And with the optional OSC Package, the OSC placement capabilities are expanded even further.

Powerful feeding solution

To operate as an end-of-line machine, the SIPLACE Tray Unit is now available for the SIPLACE TX. It uses carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 trays measuring up to 355 × 275 mm are possible. As a special feature, new trays can be refilled without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.

Perfect fit for more space on the shop floor

The SIPLACE TX is the placement solution of choice for mobile devices, increasingly complex automotive solutions, and many more applications. Whenever manufacturers wanted to integrate the processing of OSCs into the line, they previously had to resort to alternative end-of-line solutions, which take up significantly more space, as shown in this simple example: Three SIPLACE TX and one SIPLACE SX with a Waffle Pack Changer occupy an area of 13.76 square meters. Four SIPLACE TX machines, on the other hand, the last being equipped with the new SIPLACE Tray Unit, take up only 9.92 square meters – a whopping 27.5 percent less. And the SIPLACE Tray Unit protrudes less than 13 centimeters from the front of the machine.

A more balanced line

Automated OSC processing makes the entire SMT line much more balanced because it drastically accelerates the slowest placement process. It increases the line’s productivity considerably and minimizes the robot-supported or manual processing of OSCs or eliminates it completely. Another contributor to an optimally balanced line is the powerful CP20 placement head, the latest generation of which can process components that are one millimeter taller. This makes it possible to process a higher range of components at the beginning of the line, which in turn relieves subsequent machines.

Automation for the integrated smart factory

Integrating the placement of OSCs into the SMT line also enables this process to benefit from the wide-ranging capabilities of ASMPT’s flexible and manufacturer-independent Open Automation concept. In contrast to downstream manual processes, all production, product and component data is automatically recorded during the placement process and transmitted to the IT systems for seamless traceability and documentation. In addition, the productivity- and efficiency-enhancing applications of the WORKS smart shop floor management suite can also be used to their full extent for the OSC process – another important step toward the integrated smart factory.

Illustrations for downloading

The following print-ready artwork is available on the internet for downloading: https://kk.htcm.de/press-releases/asmpt/

About ASMPT Limited (“ASMPT”)

ASMPT (HKEX stock code: 0522) is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT’s offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition, to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices, which include electronics, mobile communications, computing, automotive, industrial and LED (displays). ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability and enhanced quality. 
ASMPT is one of the constituent stocks of the Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes and the Hang Seng HK 35 Index.

To learn more about ASMPT, please visit us at asmpt.com.

The ASMPT SMT Solutions segment

The mission of the SMT Solutions segment within ASMPT is to implement and support the Integrated Smart Factory at electronics manufacturers worldwide. 
ASMPT solutions support the networking, automation and optimization of central workflows with hardware, software and services that enable electronics manufacturers to transition to the Integrated Smart Factory in stages and enjoy dramatic improvements in productivity, flexibility and quality. With the integrated concept "Open Automation", ASMPT opens the door for its customers to economically feasible automation, entirely in accordance with their individual requirements - modular, flexible, and vendor-independent.

The product range includes hardware and software such as SIPLACE placement solutions, DEK printing solutions, inspection and storage solutions, and the Smart Shopfloor Management Suite WORKS. With WORKS, ASMPT offers electronics manufacturers high-quality software for planning, controlling, analyzing and optimizing all processes on the Shopfloor.

Since maintaining close relationships with customers and partners is a central component of ASMPT’s strategy, the company has established the SMT Smart Network as a global forum for the active exchange of information between and with smart champions.

For more information about ASMPT visit smt.asmpt.com.

Media contacts:
AMCAS ASMPT Press Office
SMT Solutions
Mark Ogden
+1-770-797-3189
ogden.mark@asmpt.com
smt.asmpt.com

Global ASMPT Press Office:
ASMPT GmbH & Co. KG
Susanne Oswald
Rupert-Mayer-Strasse 48
81379 Munich
Germany
Tel: +49 89 20800-26439
susanne.oswald@asmpt.com
smt.asmpt.com