NEi Software to Debut NEi Nastran V10 at SAMPE
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WESTMINSTER, CA - (May 5, 2010) - NEi Software will debut NEi Nastran V10 at SAMPE, a materials and processing technology conference being held in Seattle WA between May 18-20. Engineers will be on hand to demonstrate NEi Nastran V10 along with the suite of engineering software solutions offered by NEi Software. In addition, NEi Software will present a new white paper entitled "Simulating Fiber Metal Laminates" on May 20.
WHEN & WHERE:
SAMPE 2010 Seattle, WA
May 18-20, 2010
Visit NEi Software at booth 1610
Washington State Convention Center
800 Convention Place
Seattle, WA 98101-2350
Presentation
May 20, 2010 at 8:25AM Session: Design & Analysis IV
FEA White Paper: "Simulating Fiber Metal Laminates"
About NEi Software
NEi Software is a global provider of Nastran Finite Element Analysis (FEA), engineering simulation, and virtual test software. Engineers gain insight with digital prototypes, images, contour plots, graphs, and animations of linear and nonlinear structural stress, deformation, dynamics, vibration, kinematics, impact, heat transfer and fluid dynamic (CFD) simulations. The website features case studies in aerospace, automotive, maritime, petroleum, medical, and consumer products with demonstration videos, webinars, tutorials, and training schedules. www.NEiSoftware.com Telephone: 714.899.1220 Email: info@neisoftware.com
About SAMPE 2010 Seattle, WA
SAMPE 2010 is being held in Seattle, Washington, a first for SAMPE's Spring Conference and Exhibition. This event will showcase the latest technology, applications and materials for the advanced manufacturing marketplace. This conference will offer dozens of educational sessions, a rich curriculum of tutorials and the largest exhibit floor dedicated to the material and process industry.
