N Channel MOSFETs feature lowest package resistance.
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Press Release Summary:
Family of MOSFETs are housed in Bottomless(TM) package that combines thermal performance of larger TO-263 D²-PAK with low RDS(on) in standard SO-8 package. Family includes 150V and 200V products for 48 V telecom applications; 40 V products for use in primary side of low input voltage single transistor forward dc/dc converters; and 20 V and 30 V products for low-side switch applications in computing and synchronous rectifier isolated dc/dc converter applications.
Original Press Release:
New Family of Bottomless(TM) SO-8-Packaged MOSFETs (20v to 200v) Combines Significant Improvement in Thermal Performance with Industry's Lowest Package Resistance
San Jose, Calif.-July 31, 2002- Fairchild Semiconductor International (NYSE: FCS) introduces a new family of eighteen N-channel MOSFETs housed in the industry's first package that combines thermal performance of the much larger TO-263 (D²-PAK) with very low RDS(On) in a standard SO-8 package outline. Fairchild's advanced Bottomless(TM) packaging offers the following benefits:
o Better reliability and efficiency due to reduced die temperature for a given application
o Higher efficiency due to lower package resistance
o Higher current capability per given PCB area
o Reduced switching times due to lower package inductance and lower gate resistance
o Standard SO-8 package dimensions, footprint and compatible pin out
The eighteen new products using Bottomless technology include two 150V and two 200V products for 48V telecom DC/DC applications; six 40V products designed for use in the primary-side of low input voltage single transistor forward DC/DC converters, two transistor forward converters, and half bridge converters; and four 20V and four 30V products for low-side switch applications in computing and synchronous rectifier isolated DC/DC converter applications.
Fairchild Bottomless Technology
This unique package is constructed using the solder-bump technology that Fairchild pioneered with its MOSFET BGAs. A conventional SO-8 package is constructed using wire-bond technology. Wireless versions of the SO-8 reduce the package resistance and inductance but do not significantly improve thermal performance. The Bottomless(TM) package accomplishes both goals simultaneously by eliminating the wire-bonds and allowing the PCB heat sink to be in direct contact with the solderable backside of the MOSFET die (drain connection). This new package reduces the junction-to-case thermal resistance below 0.5°C/W, a dramatic improvement from the junction-to-lead thermal resistance of 25°C/W found in conventional SO-8 packages. The Bottomless S0-8 even has a lower thermal resistance than the D²-pak, yet its footprint is only 30mm² compared 155mm² for the D²-pak. It also enables designers to achieve the performance they are looking for in only 20% of the PCB surface area required for the D²-pak. Thermal resistance is further improved by providing heat conduction from both the drain contact on the bottom of the package and the source leads, which are thermally well coupled to the MOSFET source.
The Fairchild Bottomless package is offered in the standard- 3-source S0-8 footprint to provide greatly improved thermal handling capabilities, while maintaining compatibility with the S0-8 pin out assignments. Fairchild also offers the Bottomless S0-8 package in a unique 7-source pin out that provides the lowest package inductance and resistance contribution combined with the highest current handling available-for any standard outline S0-8 in the industry. This 7-source solution provides up to 1 milliohm lower RDS(On) vs. the standard 3-source SO-8.
20V Bottomless MOSFETs
Available now are four 20V products in the Bottomless package featuring on-resistance capabilities as low as 3.5 milliohm. They include two 3-source pin out products, the FDS6064N3 and FDS6162N3, and two 7-source pin out versions, the FDS6064N7 and FDS6162N7. Also being announced are four 30V MOSFETs with on-resistances as low as 5.5 milliohm; the 3-source pin out versions, the FDS7066N3 and FDS7064N, and the 7-source versions, the FDS7066N7 and FDS7064N7. Both the 20V and 30V Bottomless S0-8 products are targeted at low-side switch applications in notebook, desktop computer, and synchronous rectifier isolated DC/DC converter applications.
150V, 200V and 40V Bottomless MOSFETs
Also available now are two 150V products, the FDS2070N3 and FDS207ON7, and two 200V products, the FDS2170N3 and FDS2170N7. All four products are targeted at the primary-side of DC/DC converters. Simultaneously delivering high efficiency, extremely low RDS(On)and low gate charge, these PowerTrench® MOSFETs are the natural choice for demanding 48V telecom DC/DC applications. The 150-200V products are designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers.
Also being introduced are six 40V products, the 3-source FDS407ON3, FDS4072N3, and FDS408ON3, the 7-source FDS407ON7 and FDS4072N7 and the FDS408ON7, capable of achieving RDS(On) as low as 7 milliohms. These products are designed for use in the primary-side of low input voltage, single transistor forward DC/DC converters, two transistor forward converters, and half bridge converters.
Availability: Samples and production quantities are available now, with lead times of 8 weeks or more for larger orders.
For more information, contact Fairchild Semiconductor's Customer Support Center at (888) 522-5372, fax (972) 910-8036, or visit Fairchild's website at www.fairchildsemi.com.
PDFs of the datasheets are available at:
http://www.fairchildsemi.com/pf/FD/FDS6064N7.html
http://www.fairchildsemi.com/pf/FD/FDS6162N7.html
http://www.fairchildsemi.com/pf/FD/FDS6064N3.html
http://www.fairchildsemi.com/pf/FD/FDS6162N3.html
http://www.fairchildsemi.com/pf/FD/FDS7066N7.html
http://www.fairchildsemi.com/pf/FD/FDS7066N3.html
http://www.fairchildsemi.com/pf/FD/FDS7064N7.html
http://www.fairchildsemi.com/pf/FD/FDS7064N.html
http://www.fairchildsemi.com/pf/FD/FDS207ON3.html
http://www.fairchildsemi.com/pf/FD/FDS207ON7.html
http://www.fairchildsemi.com/pf/FD/FDS217ON3.html
http://www.fairchildsemi.com/pf/FD/FDS2170N7.html
http://www.fairchildsemi.com/pf/FD/FDS407ON3.html
http://www.fairchildsemi.com/pf/FD/FDS4070N7.html
http://www.fairchildsemi.com/pf/FD/FDS4072N3.html
http://www.fairchildsemi.com/pf/FD/FDS4072N7.html
http://www.fairchildsemi.com/pf/FD/FDS408ON3.html
http://fairchildsemi.comi/pf/FD/FDS4080N7.html
Fairchild Semiconductor International:
Fairchild Semiconductor International (NYSE: FCS) is a leading global supplier of high performance products for multiple end markets. With a focus on developing leading edge power and interface solutions to enable the electronics of today and tomorrow, Fairchild's components are used in computing, communications, consumer, industrial and automotive applications. Fairchild's 10,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products from its headquarters in South Portland, Maine, USA and numerous locations around the world. Please contact us on the web at www.fairchildsemi.com.
