Multilayer RF Chip Capacitor ranges from 270-1,000 pF.
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Press Release Summary:
Rated to 2,500 Vdc, Type MCH uses high Q mica dielectric to avoid cracking and delaminating associated with other SMD dielectrics in large sizes. High temperature threshold is compatible with FR4 boards and permits wave soldering. Non-magnetic version, Type MCHN, is available in same ratings. Housed in .380 x .380 in. surface mountable package, capacitor is suited for MRI coils, plasma chambers, baluns, lasers, RF power amplifiers, and transmitters.
Original Press Release:
Multilayer High Voltage RF Chip Capacitor
New Bedford, MA, January 10, 2007 - Cornell Dubilier Electronics (CDE) has expanded its series of multilayer RF chip capacitors to 2500 Vdc. The new Type MCH uses high Q mica dielectric to avoid cracking and delaminating associated with other SMD dielectrics in large sizes. The natural rugged flexibility and high temperature threshold of these chips is compatible with FR4 boards and permits wave soldering. A non-magnetic version, Type MCHN, is available in the same ratings. The MCH and MCHN were designed for use in high RF power designs where stability is critical. Applications include MRI coils, plasma chambers, baluns, lasers, RF power amplifiers and transmitters.
Type MCH is available in a 3838 (.380" x .380") (9.9 mm x 9.9mm) case size, surface mountable package. The cataloged capacitance values range from 270 pF to 1000 pF with additional exact ratings available. The MCH boasts lower ESR and higher current carrying capability than other similar dielectrics. Pricing begins at under $6.49 each in OEM quantities. Lead-time is stock to 8 wks from authorized CDE distributors. See the product datasheet and technical data at www.cde.com. For technical inquiries contact rsevigny@cde.com.
