Mobile Radio Chip provides triple-function audio solution.

Press Release Summary:



Manufactured in DRP(TM) technology at 90 nm node, WiLink(TM) v5.0 integrates mobile WLAN, Bluetooth®, and FM stereo audio in one device for mobile phones. It brings seamless cellular and Wi-Fi connectivity to consumers with VoWLAN functionality, optimized on OMAP-Vox(TM) and WiLink solutions, enabling UMA on handset across multiple operating systems. Product integrates BlueLink(TM) v6.0, which combines Bluetooth with hi-fi FM stereo and mono performance on one chip.



Original Press Release:



Industry's First Mobile Radio Triple Play with WLAN, Bluetooth® and FM Audio Integrated Solution from TI



WiLink(TM) 5.0 Platform Significantly Cuts Solution Size, Provides Seamless Connectivity Experience for Consumers

DALLAS, April 3 -- Texas Instruments Incorporated (NYSE:TXN) (TI) today announced the industry's first solution that integrates mobile WLAN (mWLAN), Bluetooth(R) and FM stereo audio all in a space-saving platform for mobile phones. As the fifth generation of TI's mWLAN platform, the WiLink(TM) 5.0 solution provides a quick time to market for handset manufacturers and caters to evolving consumer tastes for rapid data access, mobile entertainment and seamless connectivity between the WLAN and cellular networks. (See www.ti.com/wilink_5 for more information.)

"The market for mobile WLAN is maturing, and manufacturers need optimized solutions that address tighter synergy and system operation between WLAN and Bluetooth, as well as adequate support to keep up with the evolution of fixed mobile convergence," said Marc Cetto, general manager of TI's Mobile Connectivity Solutions Business. "With the WiLink 5.0 platform, TI addresses these requirements by leveraging its core product portfolio, proven experience and deployment in the cellular market, WLAN, Bluetooth and digital radio domains."

TI brings seamless cellular and Wi-Fi connectivity to consumers with VoWLAN functionality, optimized on TI's OMAP-Vox(TM) and WiLink solutions, enabling UMA on the handset across multiple operating systems such as Symbian(TM), Microsoft(R) Windows Mobile(R), Linux(R) and low level operating systems. UMA provides consumers on-the-go voice access over WLAN or the cellular network using their mobile phones, and will transition to IMS as the fixed mobile convergence market matures.

The WiLink 5.0 platform integrates TI's recently announced BlueLink (TM) 6.0 solution, which combines the industry's best performance Bluetooth with high fidelity FM stereo and mono performance on a single chip (see news release at www.ti.com/bluelink_6 ). The combination of mWLAN, Bluetooth and FM functionality allows users to perform a variety of simultaneous tasks, such as listening to the radio music on a Bluetooth headset while checking email via Wi-Fi.

Manufactured in TI's innovative DRP(TM) technology at the 90 nanometer node, the WiLink 5.0 device cuts both solution size and power consumption by up to 20 percent over competitive solutions, in critical modes of operation.

With three co-located radios, efficient management of RF is required for simultaneous operation of WLAN, Bluetooth and FM applications. The WiLink 5.0 platform takes advantage of TI's expertise from the company's four previous generations of mobile WLAN solutions, which are being shipped in more than 25 mobile handset devices and cellular convergence products today. The platform uses the second generation of TI's Bluetooth/WLAN hardware and software coexistence package, enabling re-use of existing systems, quick time to market and antenna sharing, reducing the bill of materials (BOM) for manufacturers.

TI will demonstrate its Bluetooth/802.11 coexistence package for mobile devices this week at CTIA Wireless 2006, April 5-7, at the Las Vegas Convention Center, in Central Hall -- Booth #1039. The coexistence demo runs a VoWLAN call routed to a Bluetooth headset over a shared antenna with no additional components, using TI's WiLink 4.0 mWLAN solution and BlueLink 5.0 Bluetooth single-chip solution, powered by an OMAP1710 applications processor.

Availability

TI is currently sampling WiLink 5.0 solutions to select customers. TI will provide multiple package options, including on-board and module solutions. Wide sample availability of WiLink 5.0 solutions are expected to be available in late 2006. Handsets using the WiLink 5.0 platform are expected to be on the market in early 2007.

Texas Instruments - Making Wireless

TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow. TI provides a breadth of silicon and software and 16 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, GPS, Digital TV, Bluetooth(R) and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP(TM) application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit www.ti.com/wirelesspressroom for additional information.

About Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com/ .

Trademarks

WiLink, BlueLink, DRP, OMAP and OMAP-Vox are trademarks of Texas Instruments. Wi-Fi is a registered trademark of the Wi-Fi Alliance. Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks by Texas Instruments is under license. All trademarks and registered trademarks are property of their respective owners.

More from Electrical Equipment & Systems

All Topics