Micro Connectors are rated for operation to 200°C.

Press Release Summary:




With ability to accommodate multiple conductor sizes and precision back molding, MDM Series high temperature connectors can be terminated in daisy-chain configurations within complex electronic instrumentation packages. Made of LCP thermoplastic, they accept #22 and #26 AWG wire sizes and offer combination of 0.050 and 0.100 in. spacing. Suited for geophysical and oil exploration and down-hole mapping, units feature twist pin contact system and crimped gold plated contacts.



Original Press Release:



ITT Develops High Temperature Micro Connector Assemblies for Use In Harsh Environments



Micro connector accommodates multiple conductor sizes, precision back molding...

SANTA ANA, Calif. - April 21, 2008 - ITT Interconnect Solutions, a leading global manufacturer and supplier of connectors, interconnects, and cable assemblies, has developed a series of high temperature micro connectors. Designated the MDM Series, the connectors are rated for operation to 200°C and can be terminated in daisy-chain configurations within complex electronic instrumentation packages.

"We've had a number of requests from customers for a connector solution that accommodates larger wire sizes, which in turn requires the use of high temperature back molding materials," said Keith Teichmann, director of marketing for ITT Interconnect Solutions. "The MDM Series connectors feature an integrated termination method to accommodate multiple conductor sizes and precision back molding, allowing us to meet our customers precise needs."

Typical applications for the MDM Series high temperature connectors include geophysical and oil exploration, electronic instrumentation and down-hole mapping.

The MDM Series connectors represent a complete turnkey solution based on the use of specialized high temperature materials such as LCP (liquid crystalline polymer) thermoplastic. A D-subminiature connector based on PPS (polyphenylene sulfide) thermoplastic can also be integrated into the assembly.

The micro connectors accept #22 and #26 AWG (American Wire Gauge) wire sizes and offer a combination of 1.27mm and 2.54mm (0.050" and 0.100") spacing. The MDM Series connectors also feature a twist pin contact system and crimped gold plated contacts.

Lead time for the custom MDM Series micro connectors is from
8 to 10 weeks.

About ITT Interconnect Solutions
ITT Interconnect Solutions is an international manufacturer and supplier of connectors including circular, rectangular, fiber optic, RF, power and high voltage, audio, PCMCIA, Compact Flash Card, enclosures, cable assemblies, and application specific custom solutions. The Interconnect Solutions portfolio includes the brands Cannon, VEAM, and BIW. For more information on ITT Interconnect Solutions and an archive of its press releases, please visit www.ittcannon.com.

About ITT
ITT Corporation supplies advanced technology products and services in several growth markets. ITT is a global leader in the transport, treatment and control of water, wastewater and other fluids. The company plays a vital role in international security through its defense communications and electronics products; space surveillance and intelligence systems; and advanced engineering and related services. It also serves the growing leisure marine and electronic components markets with a wide range of products. Headquartered in White Plains, NY, the company generated $7.8 billion in 2006 sales.

Leads Contact:
Nas Hashemian
ITT Interconnect Solutions
666 East Dyer Road
Santa Ana, CA 92705
Tel.: +714-628-8370
Fax: +714-628-2249
Email: nas.hashemian@itt.com

Keywords: ITT, Interconnect Solutions, MDM, micro, interconnect, high temperature

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