Materials and Adhesives create durable, functional prototypes.

Press Release Summary:

RenShape(TM) SL 7565 material builds clear, ABS-like parts with flexural modulus of 300,000 psi and elongation of greater than 20%. RenShape SL 5260 photopolymer produces opaque, white prototypes and parts with ABS thermoplastic-like surface, flexural modulus of 350,000 psi, and elongation of 12%. Adhesives, for filling and bonding stereolithography models and prototypes, include RenShape SL Bond 110 (low viscosity), SL Bond 120 (standard-viscosity), and thixotropic SL Bond 130.

Original Press Release:

Family of RenShape(TM) SL Materials Expands, Extends Applications for SL Prototypes and Parts

EAST LANSING, Mich., May 13, 2003 - Two new thermoplastic-like RenShape(TM) SL materials and several SL adhesives were introduced today by the RenShape® Solutions Tooling Group of Vantico A&T US Inc., at Rapid Prototyping & Manufacturing 2003 in Chicago. With new RenShape SL 7565 material, prototypers can build clear, ABS-like parts with a rigid flexural modulus of 300,000 psi and elongation of >20%. RenShape SL 5260 photopolymer, formulated for use on SLA® 250 He-Cd platforms, produces durable, opaque white prototypes and parts with an ABS thermoplastic-like surface. It features a rigid flexural modulus of 350,000 psi and an elongation of 12% along with good accuracy and fast processing speed.

The two new materials, along with ABS-like RenShape SL 7560 photopolymer that is formulated for use on SLA 7000 platforms, are enabling customers to expand the market for stereolithography-generated parts. For example, service bureaus are now able to use SL materials rather than conventional polyurethanes cast in RTV silicone rubber molds to produce accurate and durable functional prototypes that simulate the performance of engineering thermoplastics. RenShape SL photopolymers are also being used to make production parts such as hearing aid shells custom molded from 3-D scans of a user's ear canal.

In addition to introducing new photopolymers at the RP&M Show, Vantico announced the commercialization of a line of adhesives specially designed for filling and bonding SL models and prototypes. RenShape SL Bond 110 features an easy-to-apply low viscosity, SL Bond 120 is a standard-viscosity material and SL Bond 130 is thixotropic for good sag resistance on vertical surfaces. The adhesives are packaged in convenient, 10-ml syringes for easy, waste-free dispensing.

For more information about RenShape SL materials and adhesives, please contact: Product Information, Vantico A&T US Inc., 4917 Dawn Avenue, East Lansing, Michigan 48823, Tel: 800-285-4784, Fax: 517-351-6255; website:; E-mail address:

Vantico's RenShape Solutions Tooling Group manufactures and markets a broad range of stereolithography materials, epoxies and polyurethanes for modeling, moldmaking, prototyping and forming initial parts to the automotive, foundry, aerospace and general manufacturing industries. The company has been a world leader in plastic tooling materials for more than 60 years.

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