Laser System scribes 4 in. LED wafers.
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Press Release Summary:
Tolerant of wafer warp and bow, ChromaDice(TM) UV diode-pumped solid-state (DPSS) laser system produces well-defined chips with consistently narrow cuts as small as 2.5 microns. Accuracy performance is true, unmapped position radius of 2 microns over 100 x 100 mm square area with stage orthogonality of better than 2 arc sec. Within 60 x 42 in. footprint, self-contained machine incorporates air-cooled laser, motion control, beam delivery, and video inspection.
Original Press Release:
JPSA Announces 4-Inch LED Wafer Scribing Capability
Hollis, New Hampshire, USA JP Sercel Associates (JPSA) announces that it has developed and proven the capability to scribe 4-inch LED wafers, a larger format destined for many LED manufacturer's next generation production and recently introduced by the Taiwanese company TEKCORE Co, Ltd., a leading manufacturer of high-brightness LED wafers and chips. TEKCORE's primary products are high-brightness LED chips in 450-480nm (blue), 495-510nm (cyan), 510-530nm (green), and UV LED 370-430nm wavelengths.
The scribing process was developed using JPSA's ChromaDice(TM) UV diode-pumped solid-state (DPSS) laser system. The ChromaDice(TM) delivers high-speed wafer scribing with typical yields greater than 99% at very low operating costs.
ChromaDice(TM) cuts a well-defined chip, with consistently narrow cuts as small as 2.5 microns. Narrower streets permit increased die population, adding value to each wafer. With its high throughput and minimal impact on device performance, the process is tolerant of wafer warp and bow and delivers very fast scribing speeds compared to other methods using an advanced 266nm (or 355nm) DPSS laser process. ChromaDice(TM) delivers high performance in LEDs, GaAs, Si and other materials with the system's patent pending optical system. The machine's footprint is 60 inches by 42 inches and is fully self-contained with air cooled laser, motion control, beam delivery, and video inspection. Accuracy performance is a true, unmapped position radius of 2 microns over a 100mm by 100mm square area with stage orthogonality to better than 2 arc seconds.
Scribing of four-inch wafers can be difficult due to handling and bowing issues. Bowing of un-thinned wafers can potentially reach 1 centimeter, creating processing problems. JPSA's process involves scribing a wafer that is held precisely in a vacuum fixture that corrects wafer bowing consistently to within a few microns, ensuring precise scribing for optimum yields.
In making the announcement, Jeffrey P. Sercel, President, said, "Our scribing results have been consistently excellent with this new process. At JPSA, we're dedicated to keeping pace with emerging manufacturing technologies that deliver more efficient wafer processing with higher yields."
JPSA products and services include UV excimer and DPSS laser micromachining systems, UV and VUV laser beam delivery systems, UV laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA operates a high-performance UV laser job shop as well as a systems engineering and manufacturing business. For more information, visit www.jpsalaser.com, or contact the company at 17D Clinton Drive, Hollis, NH 03049 USA, Tel. 603.595.7048, Fax 603.598.3835. Email: info@jpsalaser.com.
