Laser System performs high-speed blue LED wafer scribing.
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Press Release Summary:
ChromaDice(TM) UV, diode-pumped, solid-state (DPSS) laser scriber delivers typical yields greater than 99%. System cuts well-defined, square chip with consistently narrow cuts as small as 5 microns. With throughput rating of up to 8 wafers/hr, unit utilizes process that is tolerant of wafer warp and bow. Automatic alignment takes less than 1 min to load and align with system's optical system. Operated by Windows® 2000 interface, unit performs 266 nm DPSS laser scribing.
Original Press Release:
JPSA Laser Announces High-Speed Blue LED Wafer Scribing Under $2/Wafer
Hollis, New Hampshire, USA -The new JPSA ChromaDice(TM) UV diode-pumped solid-state (DPSS) Laser system delivers high-speed blue LED wafer scribing with typical yields greater than 99% at less than $2 per wafer. This system cuts a well-defined, square chip, with consistently narrow cuts as small as 5 microns. With its high throughput - up to 8 wafers per hour - and minimal impact on LED performance, the process is tolerant of wafer warp and bow; and delivers very fast scribing speed compared to mechanical scribing. With the ChromaDice(TM), there are no process consumables; one achieves higher yields at lower operating costs, with full automation possible and its attendant higher precision. A single operator can run multiple systems with no impact on process yield. Automatic alignment is rapid, < 1 minute to load and align with the system's patent-pending optical system.
The operating cost of the JPSA ChromaDice(TM) system is estimated at less than $2 US per wafer with uptimes easily exceeding 99%, 24/7 maintenance-free operation. Compared to mechanical scribing, the DPSS laser process provides improved wafer throughput by 500%, with a 97.5% reduction in operating costs.
With the ChromaDice(TM), the only consumable is electricity, although periodic laser refurbishment is required; however the cost per wafer is minimal. Narrow cut widths and consistent alignment allow street widths to be reduced, increasing the die count per wafer. The ChromaDice(TM) system is operated by the user-friendly Windows® 2000 interface.
UV DPSS laser scribing is poised to replace diamond scribing for die separation on sapphire wafers. 266nm DPSS laser scribing with the ChromaDice(TM) represents the state of the art in blue LED die separation.
JPSA products and services include UV excimer and DPSS laser micro machining systems, UV and VUV laser beam delivery systems, UV laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA Laser operates a high-performance UV laser job shop as well as a systems engineering and manufacturing business.
For more information, visit www.jpsalaser.com, or contact the company at 17D Clinton Drive, Hollis, NH 03049 USA, Tel. 603.595.7048, fax 603.598.3835. E-mail: jsercel@jpsalaser.com .
