Press Release Summary:
DuPont(TM) Interra(TM) HK11 planar embedded capacitor laminate helps designers eliminate high-frequency bypass capacitors and reduce EMI and inductance. Ceramic-filled, high dielectric material is 14 microns thick and commercially available.
Original Press Release:
DuPont Electronic Technologies Introduces Interra(TM) HK11 Planar Embedded Capacitor Laminate
RESEARCH TRIANGLE PARK, N.C., Feb., 02, 2004 -DuPont Electronic
Technologies -- a leading global supplier to the electronics industry of ceramic, rigid and flexible circuit materials, integrated circuit (IC) packaging, and IC fabrication materials -- is pleased to introduce its newest offering, DuPont(TM) Interra(TM) HK11 planar embedded capacitor laminate. This is the first commercially available ultra thin, high dielectric constant capacitor laminate product, and an important extension of the existing DuPont(TM) Interra(TM) family of embedded passive materials, offering unprecedented flexibility to designers working to eliminate high-frequency bypass capacitors, and reduce EMI and inductance. DuPont Electronic Technologies will highlight this new technology at the 2004 IPC Printed Circuits Expo at the Anaheim Convention Center in Anaheim, Calif., from Feb. 24 - 26, 2004, in Booth #2257. DuPont will feature the full line of InterraTm brand embedded passive materials in conjunction with its latest developments in advanced laminates and printed circuit materials.
"DuPont(TM) Interra(TM) HK11 is the first comrmercially available ultra thin, filled material available for embedded passives applications," said Thomas D. Lantzer, global product manager, DuPont(TM) Interra(TM) planar capacitor laminate materials. "Designers are increasingly turning to embedded passive technology to enable reduction in size, improved performance and cost effectiveness of electronic devices, and DuPont is uniquely equipped to take this technology farther than anyone else."
DuPont is creating the broadest portfolio in the world for embedded passive materials under the Interra(TM) brand by combining its strengths in laminates, polymer thick films and ceramic paste materials to deliver exceptional products.
DuPont(TM) Interra(TM) HK 11 planar embedded capacitor laminate allows flexibility in design because it offers thinness combined with a high dielectric constant. This is the fourth product in the Interra(TM) series of planar embedded capacitance laminates, which includes 25 and 18 micron thick Interra(TM) HKO4, 25 micron thick Interra(TM) HK10 ceramic filled dielectric laminate and now, 14 micron thick Interra(TM) HK11 ceramic filled dielectric laminate. All of the Interra(TM) brand of laminate products are commercially available.
DuPont Electronic Technologies offers the industry's broadest array of electronic materials, including printed circuit materials, high-performance and microcircuit materials,
semiconductor fabrication materials and integrated circuit packaging and interconnects. For further information on DuPont(TM) Interra(TM) embedded passive materials visit the web site at
www.dupont.com/fcm/interra or stop by Booth #2257 during the IPC Printed Circuit Expo.
DuPont is a science company. Founded in 1802, DuPont puts science to work by solving problems and creating solutions that make people's lives better, safer and easier. Operating in more than 70 countries, the company offers a wide range of products and services to markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.
The DuPont Oval, DuPont(TM), and The miracles of science(TM), and Interra(TM) are registered trademarks or trademarks of DuPont or its affiliates.