Interconnects minimize need for PTH drilling of PCBs.
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Press Release Summary:
Only requiring laser drilling of sub-composite length, HPC-Z devices minimize plated-thru-holes (PTH) drilling needed to make signal connections within PCBs while optimizing number of available wiring lines. Products provide signal connections only where desired, with functional isolation for single or double side surface mount partitions. Providing interconnections within board, devices provide pad-to-pad connection made with conductive epoxy at lamination.
Original Press Release:
HPC-Z Interconnect Solution Provides Vertical PCB Connections with Laminations Instead of Plated-Thru-Holes for Increased Circuit Density
Endicott, NY, May 21, 2007 - Having to drill plated-thru-holes (PTHs) to make signal connections within printed circuit boards (PCBs) may become a thing of the past, thanks to a new technology from Endicott Interconnect Technologies (EI). New HPC-Z interconnections provide signal connections only where desired, with functional isolation for single or double side surface mount partitions.
The HPC-Z interconnect solves thick board drilling and wire density problems, and meets the need for functional isolation, with the capability of isolating high-speed channels on one sub-assembly and low-speed channels on another. It provides interconnections within the board, and eliminates unnecessary PTH drilling.
"Now, you only laser drill the length of the sub-composite, "said Voya Markovich, CTO and Senior Vice President of R&D. "You can eliminate PTHs that are blocking other wiring channels, which increases wireability, eliminates PTH stubs and results in a thinner and faster board.
We're working to develop full HPC-Z products that will completely eliminate the need for mechanical drilling and result in the introduction of higher density and higher speed integrated electronic packaging products."
HPC-Z provides a "PTH-like" connection at lamination with a pad-to-pad connection made with conductive epoxy. Since there is vertical connection with a lamination in place of a PTH, aspect ratios for drill and plate are limited to sub-assembly dimensions. Drilling is reduced - instead of having to drill a 300-mil-thick board through the entire structure to go from signal plane to signal plane, you can drill only where necessary. For example, instead of having to drill 3 PTHs all the way though the board with a 10 mil drill for each of 3 sub-assemblies, you can have 3 PTHs on one, 2 PTHs, on another, and 1 PTH on the other - whatever is needed and no more than is needed. This minimizing of the PTH effect results in increased wiring density due to smaller vias and lands. With HPC-Z, there are more wiring lines available that would have been closed off by PTH drilling.
"You want to place as much circuitry as close together as possible," said James Wilson, Product Manager - Printed Circuit Boards. "When you attach modules to the board, solder balls are at a certain pitch. This has shrunk over the last 10 years from 1.27 mm to 1 mm to 0.8 mm and even 0.5 mm today. You can't get this dense a pitch with traditional PTH drilling."
For more information on HPC-Z, contact Endicott Interconnect Technologies, Inc.
1701 North Street, Endicott, New York 13760. Tel: 1-866-820-4820; Fax: 607-755-7000. Or visit our web site at www.eitny.com.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnect solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging, and precision equipment manufacturing and integration. EI product lines meet the needs of markets where highly reliable products built in robust manufacturing operations are critical for success. These include IT, telecommunications, aerospace and defense, advanced test equipment, medical and power management. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know-how that provide customers with a time-to-market advantage and competitive differentiation.
