IMRA Agrees with DISCO to Jointly Develop Laser Dicing


KARIYA, Japan - IMRA America, Inc., a subsidiary of Aisin Seiki Co., Ltd., and DISCO Corporation have agreed to collaborate in the development of new lasers and processing systems for laser dicing of semiconductor materials.

IMRA America has supplied several hundred femtosecond fiber lasers* that are now being used in semiconductor manufacturing facilities, delivering the high reliability and stability required for 24/7 operation. Also, IMRA America is the exclusive licensee of US Patent 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which they license to their customers.

In the future, both companies will together provide new solutions utilizing the unique capabilities of femtosecond lasers, which minimize thermal effects in materials processing.

* Femtosecond Fiber Lasers

These lasers emit pulses of light with a temporal duration on the order of femtoseconds (1 femtosecond is 1 quadrillionth of a second) at a high repetition frequency. A major advantage of femtosecond pulses is that the pulse duration is so short it is possible to minimize thermal damage. Femtosecond laser pulses can also create modifications within transparent materials without damaging the surface.

About IMRA America, Inc.

Office: 1044 Woodridge Avenue, Ann Arbor, MI 48105-9774 USA

President:Takashi Omitsu

Capital: US$18,750,000

Founded: May 15, 1990

Major Corporations: Aisin Seiki Co., Ltd. Aisin AW Co., Ltd. Aisin Takaoka Co., Ltd.
Aisin Chemical Co., Ltd.

Business outline:Development, manufacturing, marketing, sales, after-sales service of femtosecond fiber lasers

URL: www.imra.com

About DISCO Corporation

Listed on First Section of Tokyo Stock Exchange

Office: 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580 Japan

President: Kazuma Sekiya

Capital: 14,517,469,520 yen

Founded: March 2, 1940

Business outline:

o Manufacture and sale of precision cutting, grinding and polishing machines

o Maintenance of precision cutting, grinding and polishing machines

o Training in the operation and maintenance of precision cutting, grinding and polishing machines

o Disassembly and recycling of precision cutting, grinding and polishing machines

o Lease of precision machines; sale and purchase of used machines

o Manufacture and sale of precision diamond abrasive tools

o For-fee processing

URL: http://www.disco.co.jp/eg/index.html

Contact:

Ryuichiro Sasaki

Japan Branch Office

IMRA America, Inc.

Tel: +81-566-24-9024

Fax: +81-566-62-1607

E-mail: Finfo@imra.co.jp

SOURCE IMRA America, Inc.

Web Site: www.imra.com

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