Press Release Summary:
Addressing challenges toÂ drilling equipment microelectronics, high-temperature NOR flash products meet environmental demands of oil and gas industry downhole drillingÂ where temperaturesÂ reach 150Â°C and higher. Products come in 1, 4, and 16 Mb densities and withstand temperature, shock, and vibration encountered by equipment thousands of feet below surface. Package options include hermetic ceramic dual inline, small outline J-lead, flatpacks, ceramic quad flat pack,Â and pin grid array.
Original Press Release:
Microsemi High Temperature Flash Memory Products Withstand Environmental Challenges of Deeper Oil and Gas Drilling
Products Designed for Operation Under Extreme Temperature, Shock and Vibration Conditions
ALISO VIEJO, Calif. -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its launch of high temperature flash memory products, tailored to meet the environmental demands of oil and gas industries' downhole drilling. The new high-temperature NOR flash products are designed for temperatures of 150°C and higher, and provide improved endurance benefits to systems designers. They can withstand the temperature, shock and vibration challenges encountered by drilling equipment thousands of feet below the surface.
"Our company has been providing high-reliability microelectronics for decades," said BJ Heggli, vice president of strategic development and assistant general manager for Microsemi. "We understand the importance of high-reliability operation under tough conditions, which is why our products are subjected to stringent design, characterization and testing processes. Our company has unique capabilities to address the increased needs for higher density and temperature and we are excited about the launch of the first of several downhole product offerings."
The oil and gas industries are increasingly turning to unexplored areas as conventional sources of oil and gas decline. The high temperatures and pressures often found in these areas present complex challenges to the microelectronics used on drilling equipment. A substantial percentage of breakdowns in downhole systems is caused by failures in the electronics.
About High Temperature Flash
The new NOR flash product line is available in hermetic ceramic dual inline (DIP) small outline J-lead, (SOJ), flatpacks, ceramic quad flat pack (CQFP), or pin grid array (PGA) packages, and in 1 megabit (Mb), 4Mb and 16Mb densities.
Microsemi has full design, manufacture and test capabilities for a wide variety of Multiple Chip Packages (MCPs), commercial-off-the-shelf (COTS) memory, microprocessors and combination MCPs for demanding applications. These microelectronic products can also be customized for special requirements. For more information, call 602-437-1520.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance, radiation-hardened and highly reliable analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
Director of Corporate Communications
Beth P. Quezada